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Photonics Source provides 15 products. Download datasheets, request quotes, and compare function, price, and availability.
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P Series ALD Platform
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D substrates Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500) -
P Series ALD Systems
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D substrates Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500) -
TFS Series
Process Type: Thermal ALD Process Type: PEALD Substrate Type TFS200: 200×200mm 3D components, powder materials Substrate Type TFS500: 300×370×470mm glass substrates, 3D components, powder materials Substrate Loading: Automatic -
TFS Series
Process Type: Thermal ALD Process Type: PEALD Substrate Type TFS200: 单片200mm 200×200mm 3D部 Items 粉状材料 Substrate Type TFS500: 单片300mm 单片370×470mm玻璃基底材料 3D部 Items/粉状材料 Substrate Loading: 自动, 手动 -
SRII-300
Dimensions: 7.52×3.19×3.08m Wafer Size: 200mm/300mm Species: B/P/As (expandable) Application: Logic/Memory/Power/CIS etc. Energy Range: 2-900keV -
SRII Ion Implanter Series
Product: SRII-60, SRII-200, SRII-1.5M, SRII-4.5M SiC, SRII-200 SiC, SRII-300 SiC, SRII-4.5M, SRII-8M, SRII-300 Dimensions: 6.48×2.76×3.06m, 6×3×3.06m, 9.2×4.2×3m, 8.03×4.6×2.86m, 6×3×3.06m, 7.52×3.19×3.08m, 8.9×4.2×2.86m, 9.7×4.4×2.86m, 7.52×3.19×3.08m Wafer Size: 200mm/300mm, 150mm/200mm Species: H/He, Al/N/B/P/As, B/P/As Application: SOI materials, semiconductor devices, power devices, SiC, logic/memory/power/CIS -
SRII-300
Dimensions: 7.52×3.19×3.08m Wafer Size: 200mm/300mm Species: B/P/As (expandable) Application: Logic/Memory/Power/CIS etc. Energy Range: 2-900keV -
SRII Ion Implanter Series
Product: SRII-60, SRII-200, SRII-1.5M Dimensions: 6.48×2.76×3.06m, 6×3×3.06m, 9.2×4.2×3m Wafer Size: 200mm/300mm Species: H/He Application: SOI materials -
SRII Ion Implanter Series
Dimensions SRII-60: 6.48×2.76×3.06m Dimensions SRII-200: 6×3×3.06m Dimensions SRII-1.5M: 9.2×4.2×3m Dimensions SRII-4.5M: 8.9×4.2×2.86m Dimensions SRII-8M: 9.7×4.4×2.86m -
SRII MCI Ion Implanter
Dimensions: 7.52×3.19×3.08m Wafer Size: 200mm/300mm Species: B/P/As (expandable) Application: Logic/Memory/Power/CIS etc. Energy Range: 2-900keV -
P Series
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D objects Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500) -
P Series ALD Platform
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D substrates Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm (P400A), 550×310×700mm (P800), 1300×2400×750mm (P1500) -
P Series ALD Platform
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D objects Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500) -
Genesis ALD
Process Type: Spatial Thermal ALD Substrate Type: Polymer Substrate Type: steel Substrate Type: glass Substrate Type: stainless steel -
P Series ALD Platform
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer and 3D substrates Vacuum Chamber Size: Φ400mm (P400A), Φ800mm (P800), Φ1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette (P400A), 550×310×700mm (P800), 1300×2400×750mm (P1500)