TFS Series
The TFS series is designed for scientific research and enterprise development, offering flexible ALD platforms that can be customized and upgraded to meet diverse user needs.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Process Type | Thermal ALD |
| Process Type | PEALD |
| Substrate Type TFS200 | 单片200mm 200×200mm 3D部 Items 粉状材料 |
| Substrate Type TFS500 | 单片300mm 单片370×470mm玻璃基底材料 3D部 Items/粉状材料 |
| Substrate Loading | 自动, 手动 |
| Process Temperature Range | 25-500°C |
| Integrable Modules | Glove box/Load-lock/Cluster |
| Reaction Chamber Quantity and Size TFS200 | 单片Thermal, 单片Plasma 3D/批量沉积反应腔, 最大尺寸200mm晶圆 |
| Reaction Chamber Quantity and Size TFS500 | 单片Thermal, 单片Plasma 3D/批量沉积, 粉状反应腔 |
| Reaction Sources TFS200 | 8路液体源 (+5°C至室温) 4路液体源H5300 (室温至300°C) |
| Reaction Sources TFS500 | 5路气体源 4路液体源 (+5°C至室温) 4路液体源H5300 (室温至300°C) |
| Plasma Type (PEALD) | 电容耦合等离子体 (CCP) 功率可调 |
| Main Equipment Dimensions TFS200 | 1325×600×1298mm |
| Main Equipment Dimensions TFS500 | 1600×900×1930mm |
Applications
Key Features
Datasheet
Supplier Information
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