P Series ALD Systems
P Series ALD systems are designed for industrial-scale production, offering large reaction chambers for high-volume thin film deposition. They ensure batch uniformity and provide flexible options for different substrate types and film thicknesses.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Process Type | Thermal ALD |
| Process Temperature Range | 25-550°C |
| Substrate Type | Silicon wafers, glass, metal materials, polymer 3D substrates |
| Vacuum Chamber Size | ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) |
| Reaction Chamber Loading and Size | 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500) |
| Precursor Volume | 5 standard cylinders, user-defined cylinders and maximum 10 cylinders (P400A, P800); maximum 16.2L (P1500) |
| Equipment Dimensions | 2400×930×2420mm (P400A), 3200×1340×2460mm (P800), 6195×2480×2600mm (P1500) |
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Key Features
Datasheet
Supplier Information
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