TFS Series
The TFS series is designed for scientific research and enterprise development, offering flexible ALD platforms that can be customized and upgraded to meet diverse user needs.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Process Type | Thermal ALD |
| Process Type | PEALD |
| Substrate Type TFS200 | 200×200mm 3D components, powder materials |
| Substrate Type TFS500 | 300×370×470mm glass substrates, 3D components, powder materials |
| Substrate Loading | Automatic |
| Substrate Loading | manual |
| Process Temperature Range | 25-500°C |
| Integrable Modules | Glove box/Load-lock/Cluster |
| Reaction Chamber Quantity and Size TFS200 | 8 chambers (4 heated, 4 unheated), max size 200mm |
| Reaction Chamber Quantity and Size TFS500 | 5 chambers (4 heated, 1 unheated), max size 300mm |
| Plasma Type (PEALD) | CCP |
| Plasma Type (PEALD) | power adjustable |
| Main Equipment Dimensions TFS200 | 1325×600×1298mm |
| Main Equipment Dimensions TFS500 | 1600×900×1930mm |
Applications
Key Features
Datasheet
Supplier Information
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