SRII Ion Implanter Series
The SRII Ion Implanter Series offers advanced ion implantation solutions for semiconductor manufacturing, featuring high precision, energy efficiency, and compatibility with various wafer sizes.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Species | H/He, Al/N/B/P/As, B/P/As |
| Application | SOI materials, semiconductor devices, power devices, SiC, logic/memory/power/CIS |
| Energy Accuracy | ±1% |
| Max Wafer Temperature | 600°C |
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Key Features
Datasheet
Supplier Information
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Processing size range: 2 inch / 4 inch / 6 inch (8 inch and above products require customization) Applicable chip size: 3*5 mil~150*150 mil (other sizes can be verified together) Appearance yield: ≥99 %
Unattended fully automatic operation;; Automatic recipe file retrieval by scanning code;; Intelligent contour processing for broken wafers;; Automatic calibration function for continuous processing;; Foreign object detection function for material sheets;; Gripper anti-collision function;; Blade wear monitoring and warning function;; LED, semiconductor wafer splitting (SiC, Si, GaN, sapphire and other brittle materials);; Substrate splitting in other industries (ceramics, glass and other brittle materials)
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