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Photonics Source provides 8 products. Download datasheets, request quotes, and compare function, price, and availability.
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WB20 Ultrasonic Wire Bonding Machine
Operating Frequency: 60kHz Bonding Wire Diameter Range: 15-75μm Bonding Speed: 5000 bonds/hour Worktable Dimensions: 300mm x 300mm Microscope Magnification: 10x-100x -
TM21手动贴膜Equipment
Equipment Dimensions: 500x400x300mm Laminating Speed: ≤30m/min Power Requirements: 220V, 50Hz Weight: 25kg Applicable Film Width: ≤300mm -
S17 High-Precision Intelligent Sorting Equipment
Sorting Accuracy: ±0.01mm Sorting Speed: Up to 5000 units/hour Power Supply: AC220V, 50Hz Dimensions: 1200mm x 800mm x 1500mm Weight: 450kg -
扩晶Equipment
Equipment Dimensions: 600mm x 800mm x 1200mm Power Requirements: 220V, 50Hz Maximum Crystal Size: 200mm Operating Temperature Range: 0°C to 50°C Control System: Touchscreen interface with automated controls -
M18 Multi-Chip Intelligent Mounting Equipment
Mounting Accuracy: ±0.01mm Mounting Speed: Up to 10,000 UPH Supported Chip Size: 0.2mm x 0.2mm to 10mm x 10mm Equipment Dimensions: 1500mm x 1200mm x 1800mm Power Consumption: ≤5kW -
G19
Device Dimensions: 1200mm x 800mm x 1800mm Operating Voltage: 220V Power: 2kW Mounting Accuracy: ±0.01mm Maximum Mounting Speed: 5000 units/hour -
High-Precision Crystal Bonding Equipment
Equipment Dimensions: 1200mm x 800mm x 1800mm Operating Voltage: 220V Power: 2kW Bonding Accuracy: ±0.01mm Operating Temperature Range: 10°C-40°C -
A19 FC
Equipment Dimensions: 2000mm x 1500mm x 1800mm Weight: 1200kg Chip Size Range: 0.5mm x 0.5mm to 10mm x 10mm Bonding Accuracy: ±3μm Bonding Speed: Up to 5000 UPH