Photonics Source provides 136 categories and 7939 products.
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滑台组合类型3轴系列 (3-Axis Slide Stage Combination Series)
Unidirectional Position Repeatability (XYZ 50/50/50mm Model): ±50nm XYZ Effective Travel (XYZ 50/50/50mm Model): 50/50/50mm XYZ Thrust (XYZ 50/50/50mm Model): 26/26/26N Maximum Horizontal Load (XYZ 50/50/50mm Model): 10kg Unidirectional Position Repeatability (XYZ 110/50/50mm Model): ±50nm -
High-precision Automatic Die Bonder
Placement Accuracy: ±5um @3 sigma; ±3um (Standard Die) Placement Angle Accuracy: ±0.3° @3 sigma Bonding Force: 10gf~200gf (Programmable) Single Die Bonding Time: ≤6s Dispensing System: Glue Dipping or Glue Writing -
粗线键合焊线机 XB-7024（Heavy Wire Bonder）
Work Area X-axis: 60mm/0.1um Work Area Y-axis: 100mm/0.1um Work Area Z-axis: 55mm/0.05um Work Area T-axis: ±220°/0.01° Wire Diameter Range: 4mil-20mil(100um-500um) -
Module Wire Bonding Machine
Working Area X Axis: 300mm/0.05um Working Area Y Axis: 300mm/0.05um Working Area Z Axis: 50mm/0.05um Working Area T Axis: ±220°/0.01° Wire Diameter Range: 4mil-20mil(100um-500um) -
multiple模光器 Items耦合机
Standard Model: 单四轴，双四轴，双六轴 Coupling Packaging Process Type: SR1，SR4，SR8，AOC Compatible Coupling Component Type: 透镜，透镜阵列，COB，FA -
Single-mode Optical Device Coupling Machine (单模光器 Items耦合机)
Standard Models: 单Lens耦合，双Lens耦合，单FA耦合，双FA耦合 Supported Packaging Types and Processes: BOX，COB，陶瓷基板（Ceramic Substrate），SIOB，PLC芯片（PLC Chip），硅光芯片（Silicon Photonics Chip），COC To PIC，SIOB，COC To FA，COC To Collimator，V-groove Applicable Product Types for Coupling Production: CWDM，DR系列（DR Series），FR系列（FR Series），光引擎（Optical Engine），LR4，ER4，SOA（半导体光放大器），可调激光器（Tunable Laser），相干类Products（Coherent Products），激光传感器（Laser Sensor），RGB激光Products（RGB Laser Products） Applicable Components for Coupling: 透镜（Lens），透镜阵列（Lens Array），棱镜（Prism），FA，BLOCK，光纤（Fiber），MUX，DMUX，准直器（Collimator），适配器（Adapter），SIOB，COC，PIC Position Repeatability: ±50nm -
OSP3800 OLP Optical Line Protection Card
Working Wavelength Range: 1260nm~1650nm OLP Type: OLP-1:1/OLP-1+1/OLP-1-1/OLP-BIDI Switching Time OLP-1:1: <35ms Switching Time OLP-1+1: <15ms Switching Time OLP-1-1: <15ms -
TA pro
Wavelength Range (nm) DLC TA pro: 632-1590* Wavelength Range (nm) TA pro 670: 665-673 Wavelength Range (nm) TA pro 765: 760-785 Wavelength Range (nm) TA pro 780: 770-795 Wavelength Range (nm) TA pro 795: 775-805 -
Funnel-Top Micro Quartz Cuvette
Material: UV-grade quartz glass (JGS1) Spectral Range: 190–2500nm Optical Path Length: 10mm External Dimensions: 12.5×12.5×45mm Z Dimension (Beam Center Height): 15mm -
Linear Variable Filter (LVF)
Product Shape: Circular Surface Structure: Grid-segmented pattern Coating Color Gradient: Green→Yellow→Orange-Red Gradient Direction: Linear Gradient Direction: along one axis -
Optical Prism
Reflecting Face Working Angle (45° Prism): 45° Prism Working Angle (60° Prism): 60° -
FemtoFErb 1560
Model: FemtoFErb 1560 Center Wavelength: 1560nm Laser output: Fiber-coupled Fiber Connector: FC/APC Fiber Pigtail Length: 200mm -
Benchtop Thin-Film Thickness Analyzer (Spectroscopic Reflectometer)
Measurement Principle: Spectral reflectance Thickness Measurement Range: 15Å–70µm Wavelength Range: 380–1050nm Thickness Accuracy: ±0.4% Repeatability (1σ): ≤0.1% -
Fully Automatic Optoelectronic Device Die Bonding and Assembly System
Equipment Type: Fully automatic die bonding and assembly system Configuration: Dual-station enclosed chamber with front double doors Observation Window: Large transparent safety windows on processing chamber Operator Interface: Dual touchscreen HMI panels Status Indicator: Multi-color tower light (red/yellow/green) -
Filmetrics F3-CS Compact Thin-Film Thickness Measurement System
Measurement Principle: Spectral Reflectance Film Thickness Range: 15nm-75μm Wavelength Range: 380-1050nm Light Source: Tungsten-Halogen Lamp Spectrometer Detector: CCD Array -
SpecMetis Spectral Remote Sensing Industry Application Software
Supported Vegetation Indices: NDVI Supported Vegetation Indices: EVI Supported Vegetation Indices: NDRE Supported Vegetation Indices: PSRI Supported Vegetation Indices: RVI
