Fully Automatic Optoelectronic Device Die Bonding and Assembly System
This is a fully automatic high-precision die bonding and assembly system designed for optoelectronic device manufacturing. Based on the product image, the equipment features a dual-station enclosed processing chamber with large observation windows, dual HMI touchscreen control panels, multi-color tower status lights, and automated cassette/magazine loading for substrates or wafers. The system integrates precision motion control, vision alignment, and automated material handling to achieve high-throughput, high-accuracy die attach, component placement, and packaging processes for photonic and semiconductor devices. The enclosed clean-room-compatible design with safety interlocks ensures process stability, particle control, and operator safety during continuous production.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Equipment Type | Fully automatic die bonding and assembly system |
| Configuration | Dual-station enclosed chamber with front double doors |
| Observation Window | Large transparent safety windows on processing chamber |
| Operator Interface | Dual touchscreen HMI panels |
| Status Indicator | Multi-color tower light (red/yellow/green) |
| Loading/Unloading Method | Automatic cassette/magazine handling |
| Emergency Stop | Equipped with E-stop buttons on both control panels |
| Control Buttons | Start/Stop/Reset push buttons with indicator lamps |
| Pneumatic Interface | External air supply connection with tubing on right side |
| Cabinet | Lower storage cabinets with ventilation and lockable doors |
| Safety Interlock | Door interlock switches on chamber doors |
| Operating Environment | Cleanroom-compatible design |
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Datasheet
Supplier Information
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