High-precision Automatic Die Bonder
The LASER X High-precision Automatic Die Bonder is a precision die bonding solution designed for multi-chip hybrid assembly of optical devices and sensors, including COB and BOX packages. It achieves placement accuracy of ±3um (standard die) and ±5um @3 sigma, supports automatic changeover of up to 4 nozzle types, and offers coexisting glue-dipping and glue-writing dispensing systems. With flexible material handling for up to four 6-inch expanded wafer rings, plus optional Waffle Pack, Gel-Pak, or custom fixtures, it provides a highly adaptable platform for advanced optoelectronic packaging.
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Placement Accuracy | ±5um @3 sigma; ±3um (Standard Die) |
| Placement Angle Accuracy | ±0.3° @3 sigma |
| Bonding Force | 10gf~200gf (Programmable) |
| Single Die Bonding Time | ≤6s |
| Dispensing System | Glue Dipping or Glue Writing |
| Ejector System | 1 Set |
| Loading System | 4pcs 6-inch Expanded Wafer Rings |
| Vision Alignment System | 3 Sets of Down-view Cameras + 1 Set of Up-view Camera, Optional RGB Three-color Light Source |
| Die Size | Min: 0.12mm*0.12mm; Max: 5mm*5mm |
| Substrate Carrier Size | Width: 50~100mm; Length: 50~200mm |
| Loading/Unloading Magazine | 2pcs |
| Power Supply | 200-240VAC, 50-60Hz, 3000W |
| Air Supply | Compressed Air: 0.5~0.6Mpa / Vacuum: -60~-80KPa |
| Machine Dimensions | 1240mm(L)x1160mm(W)x1830mm(H) |
| Machine Weight | 1200kg |
Applications
Key Features
Datasheet
Supplier Information
Related Products
-
Module Wire Bonding Machine
Packages
Laserx
Working Area X Axis: 300mm/0.05um Working Area Y Axis: 300mm/0.05um Working Area Z Axis: 50mm/0.05um
The LASER X Module Wire Bonding Machine is a high-precision ultrasonic bonding system designed for power semiconductor module packaging. It features a direct-drive motion platform and on-the-fly vision system to maximize throughput, and a gantry XY platform that supports a large bonding area of 300mm x 300mm. The machine supports flexible switching between aluminum wire, aluminum ribbon and copper wire bonding heads, covering wire diameters from 4mil to 20mil (100um-500um) and ribbon sizes from 20x4mil to 80x10mil. With 60KHz or 80KHz ultrasonic transducers, motor-driven high-resolution encoder feedback wire feeding, online pull force testing, and a bonding cycle of less than 1 second, it delivers efficient, reliable and high-quality interconnection for power modules, battery packs and semiconductor devices.
-
粗线键合焊线机 XB-7024（Heavy Wire Bonder）
Packages
Laserx
Work Area X-axis: 60mm/0.1um Work Area Y-axis: 100mm/0.1um Work Area Z-axis: 55mm/0.05um
The LASER X XB-7024 is a fully automatic heavy wire bonding machine designed for power semiconductor packaging. Equipped with dual bonding heads, it supports ultrasonic bonding of thick aluminum wire (100um-500um) and aluminum ribbon, featuring programmable ultrasonic power at different bonding stages, real-time wire length detection, stable bonding force control, and online pull force testing. With a throughput of up to 8K/H for four-row TO252 devices, it delivers high efficiency and reliable interconnection quality for single-row to eight-row matrix power devices.
-
芯片耦合测试机
Packages
Laserx
Supported Chip Types: 硅光，薄膜铌酸锂 Supported Product Forms: 蓝膜，单DIE，Bar条 Loading/Unloading Method: 全自动上下料
The Chip Coupling Test Machine is a fully automatic optical coupling and testing system designed for photonic chips such as silicon photonics and thin-film lithium niobate. It supports devices in blue film, single DIE and bar formats, and integrates high-precision automatic probing, linear motor coupling, automatic optical adhesive dispensing, needle cleaning, binning, OCR recognition and MES data upload. With a controllable temperature range of 25℃~80℃, optical coupling completed within 30s, coupling repeatability better than 0.2dB and optical power stability within 0.2dB@3min, it delivers efficient, accurate and stable testing for photonic chip R&D and mass production.
-
Precision Metal Shim Ring (Laser-Engraved Optical Spacer Washer) 58×0.15×40mm
Packages
Zzqsjm
Overall Dimensions: 58×0.15×40mm Outer Diameter: 58mm Thickness: 0.15mm
This product is an ultra-thin precision metal shim ring (flat annular spacer washer) with a gold-colored finish, marked by permanent laser engraving. According to the laser markings on the rings, the part number is H4Z1001-8, the serial numbers are 01-2-9115-L75 and 01-2-9116-L75, the batch code is 168170, and the overall dimension specification is 58×0.15×40mm, corresponding to an outer diameter of 58mm, a thickness of 0.15mm and an inner diameter of 40mm. Each ring carries an SD manufacturer marking and a unique serial code for full production traceability. With its precise, ultra-thin geometry, this type of shim ring is typically used for accurate spacing, alignment and gap adjustment in optical, opto-mechanical and laser module assemblies.
Related Articles
Founded in 2004, Wuhan Union Optic Inc. is a National Specialized, Refined, Unique & Innovative "Little Giant" high-tech enterprise located in Wuhan East Lake High-Tech Development Zone.
Semiconductor laser diodes are essential light sources for industrial sensing, LiDAR and laser printing. Many engineers waste time picking mismatched models. We summarize 4 simple selection standards, plus a mature industrial product: HGLD-790TO5.6-ZSP-10mW from HAUCORE.
Electro-optic deflectors (EODs) are optical devices used to steer or deflect light beams by applying an electric field to a specialized optical crystal. Unlike mechanical beam steering systems that rely on moving mirrors, electro-optic deflectors enable high-speed, non-mechanical beam control with exceptional precision and responsiveness. They are widely used in laser scanning, optical communications, microscopy, laser printing, spectroscopy, and scientific research, where rapid and accurate laser beam positioning is essential.
In photonics and laser technology, devices that manipulate optical signals via the electro-optic effect form the backbone of precision optical systems. Electro-optic phase modulators and electro-optic deflectors are two prominent examples of this device category. As a critical hardware solution for high-speed, high-accuracy laser beam direction control, electro-optic deflectors are widely deployed across industrial and research settings. Below is a detailed overview of their core structure, key performance drivers, and primary use cases.
Loading...
Name
Phone
Organization
Use Case
Database Platform