Benchtop Thin-Film Thickness Analyzer (Spectroscopic Reflectometer)
A compact benchtop optical metrology system designed for fast, non-contact and non-destructive thickness measurement of transparent and semi-transparent thin films. Based on the image, the instrument integrates a manual sample stage with a vacuum chuck, an enclosed optical measurement head protected by a flip-up cover, and a single-box architecture that is easy to deploy in laboratories, cleanrooms and production lines. Working on the principle of spectral reflectance, the system illuminates the sample with broadband light, collects the reflected interference spectrum with a built-in spectrometer, and calculates film thickness by fitting the spectrum against a materials library of refractive index (n & k) data. It measures single-layer and multilayer stacks such as oxides, nitrides, photoresists, ITO, anti-reflection coatings and polymer films on wafers, glass or metal substrates, delivering results in seconds without any sample preparation.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Measurement Principle | Spectral reflectance |
| Thickness Measurement Range | 15Å–70µm |
| Wavelength Range | 380–1050nm |
| Thickness Accuracy | ±0.4% |
| Repeatability (1σ) | ≤0.1% |
| Measurement Spot Size | ≈1.5mm |
| Measurement Time | <1s |
| Measurable Film Layers | 1–3 |
| Light Source | Tungsten-halogen lamp |
| Detector | CCD array spectrometer |
| Sample Stage | Manual stage with vacuum chuck |
| Maximum Sample Size | ≤150mm |
| Data Interface | USB |
| Power Supply | 100–240VAC,50/60Hz |
| Software | Windows-based thin-film analysis software with materials library |
| Form Factor | Benchtop, single-box design with flip-up optical head |
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Datasheet
Supplier Information
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