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Photonics Source provides 74 products. Download datasheets, request quotes, and compare function, price, and availability.
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SRII Ion Implanter Series
Product: SRII-60, SRII-200, SRII-1.5M Dimensions: 6.48×2.76×3.06m, 6×3×3.06m, 9.2×4.2×3m Wafer Size: 200mm/300mm Species: H/He Application: SOI materials -
SRII Ion Implanter Series
Dimensions SRII-60: 6.48×2.76×3.06m Dimensions SRII-200: 6×3×3.06m Dimensions SRII-1.5M: 9.2×4.2×3m Dimensions SRII-4.5M: 8.9×4.2×2.86m Dimensions SRII-8M: 9.7×4.4×2.86m -
SRII MCI Ion Implanter
Dimensions: 7.52×3.19×3.08m Wafer Size: 200mm/300mm Species: B/P/As (expandable) Application: Logic/Memory/Power/CIS etc. Energy Range: 2-900keV -
P Series
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D objects Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500) -
P Series ALD Platform
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D substrates Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm (P400A), 550×310×700mm (P800), 1300×2400×750mm (P1500) -
P Series ALD Platform
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D objects Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500) -
Genesis ALD
Process Type: Spatial Thermal ALD Substrate Type: Polymer Substrate Type: steel Substrate Type: glass Substrate Type: stainless steel -
P Series ALD Platform
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer and 3D substrates Vacuum Chamber Size: Φ400mm (P400A), Φ800mm (P800), Φ1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette (P400A), 550×310×700mm (P800), 1300×2400×750mm (P1500) -
Metal Heater
Surface Roughness (Ra): <0.4μm Flatness: <0.025mm Perpendicularity: <0.05mm Welding Bonding Rate: ≥95% Temperature Uniformity: ±1% -
V Series Mass Flow Controller (MFC)
Flow Range: 0.025-2000sccm Control Accuracy: ±0.5%S.P. (0.5%-100%F.S.) Response Time: <100ms (10%-100%F.S.), <300ms (0.5%-10%F.S.) Leak Rate: <10⁻⁹atm·cc/sec (He) Repeatability: ±0.2%S.P. (0.5%-100%F.S.) -
Variable Beam Laser System - Flux H Series
Laser Process Head Dimensions (Height×Width×Depth): 150mm×205mm×425mm Max. Weight (Laser Process Head): 15kg Control Cabinet Dimensions (Length×Width×Depth): 804mm×565mm×843mm Max. Weight (Control Cabinet): 70kg CW-nominal Output Power: 4000W -
Flux H Series Variable Beam Laser System
Beam Uniformity for mass soldering: ≥97% Beam Uniformity for chip repair: ≥90% Beam Length (both directions) for mass soldering: 2to200mm continuously adjustable Beam Length (both directions) for chip repair: 0.2to5mm fixed Power Output for mass soldering: 4000W,976nm -
Diode Laser System for Laser Wafer Annealing - DLight®S Series
Operation Mode: CW Max Output Power: 1500W Standard Output Power: 1050W Power Stability: ±2% Wavelength: 808nm -
Industrial Laser System for Material Processing - Activation Series
Product Code ACT300159: LM-AIR500-L155×0.4 Product Code ACT300161: LM-AIR900-L155×0.4 Product Code ACT300162: LM-AIR1000-L350×0.4 Product Code ACT300163: LM-AIR1800-L350×0.4 Dimensions (H×W×D) ACT300159: 395×305×285mm