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Photonics Source provides 74 products. Download datasheets, request quotes, and compare function, price, and availability.
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SOPHI
Processing Capacity: High throughput Control System: Automated with touch screen interface Dimensions: Compact design for cleanroom integration Power Requirements: Standard industrial power supply Compatibility: Supports various wafer sizes and materials -
High-Precision Coating System
Coating Uniformity: ≤0.5% Maximum Substrate Size: 300mm Cycle Time: ≤60s Power Consumption: ≤10kW Vacuum Level: ≤10^-6 Torr -
CERC-300
Processing Capacity: 300mm wafers Vacuum Level: High vacuum Control Accuracy: ±0.1% Dimensions: 2000mm x 1500mm x 2500mm Weight: 1500kg -
NLD-570
Dimensions: 1200mm x 1500mm x 1800mm Weight: 1500kg Power Requirements: AC200V, 50/60Hz, 3-phase Gas Flow Control Range: 0-500sccm Vacuum Level: 1x10^-6Pa -
Unknown
Dimensions: Unknown Weight: Unknown Power Consumption: Unknown Operating Temperature: Unknown Input Voltage: Unknown -
Dry Etching System NE-7800
Number of Chambers: 2 Processing Capability: High throughput Etching Precision: High Supported Materials: Various semiconductor materials Control System: Advanced automated control -
NE-7800 Dry Etching System
Number of Chambers: 2 Processing Capability: High-volume production Etching Precision: Sub-micron level Supported Materials: Various semiconductor materials Control System: Advanced automated control -
ULVAC Semiconductor Processing Equipment
Processing Capacity: High throughput Precision: Sub-micron level Compatibility: Supports various wafer sizes Energy Consumption: Optimized for low power usage Dimensions: Compact design for space efficiency -
Unknown
Dimensions: Unknown Power: Unknown Accuracy: Unknown -
IH-860 DISC
Working Pressure: 1×10^-3Pa Target Size: 8 inches Substrate Size: 3.5 inches Deposition Rate: 1.2nm/s Film Thickness Uniformity: ±2% -
CS-200
Operating Temperature: 15°C-30°C Power Requirements: AC200V, 50/60Hz Chamber Dimensions: 500mm x 500mm x 500mm Deposition Rate: 0.1nm/s-10nm/s Substrate Size: 200mm x 200mm -
DMS-300
Working Pressure: 1×10^-3 Pa Target Size: 300mm Deposition Rate: Up to 10nm/min Substrate Size: Up to 200mm Power Type: DC/RF -
DMS-700
Working Pressure: 1×10^-3 Pa Target Size: 200mm Deposition Rate: 1nm/s Substrate Size: 150mm Power Supply: 10kW -
CC-200
Operating Voltage: AC200V Power: 10kW Vacuum Degree: ≤1×10^-5Pa Chamber Size: 600mm x 600mm x 600mm Coating Speed: ≤5nm/s -
OSTINATO (34 Slots all-in-one-system)
Model: OSTINATO (34 Slots all-in-one-system) Water Size: 6&8 inch Dimension: 3400(W)×2600(D)×2600(H) Test Item: HITGB Burn-in, IGSS, IDSS, VTH Measurement DUT: 2,048 DUT/Slot (Option: 4,096 DUT) -
ETS-88 Duo
Test Turn Table with Heater: Integrated Hot Temp Test: Available Room Temp Test: Available Input Wafer Vision: V1, V2 Output Wafer Vision: V11 -
Fiber Laser IPG 20W MOPA
Laser Type: Fiber Laser IPG 20W MOPA Laser Wavelength: 1064nm Maximum Energy: 1mJ/Pulse Maximum Power: 20W Output Power Range: 10-100% -
Elite Etch System
Etching Machine Composition: Height:300mm(13in),Width:190mm(7.5in),Depth:305mm(12in) Bottle Assembly: Height:254mm(10in),Width:280mm(11in),Depth:127mm(5in) Weight: 16kg(35lb) Power: 90-250VAC,50/60Hz(4amp) Openable Copper Wire Encapsulation: Up to 0.8mil copper wire -
TruPlasma RF Series 1000/3000
Output Power Range TruPlasma RF 1001 (G2/13): 1W...1000W Output Power Range TruPlasma RF 1002 (G2/13): 1W...2000W Output Power Range TruPlasma RF 1003 (G2/13): 1W...3000W Maximum Reflected Power: 600W Output Frequency: 13.56MHz ±0.005% -
TruPlasma RF 1000 Air Series
Output Power TruPlasma RF 1000-0.6/13 Air: 0.6kW Output Power TruPlasma RF 1000-1/13 Air: 1kW Rated Power TruPlasma RF 1000-0.6/13 Air: 0.6kW Rated Power TruPlasma RF 1000-1/13 Air: 1kW Nominal Load Impedance: 50Ω