Industrial Laser System for Material Processing - Activation Series
The Activation Series is a high-performance industrial laser system designed for material processing applications. It offers high beam uniformity, power density, reliable control, and protection functions, with an expandable beam length.
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Product Code ACT300159 | LM-AIR500-L155×0.4 |
| Product Code ACT300161 | LM-AIR900-L155×0.4 |
| Product Code ACT300162 | LM-AIR1000-L350×0.4 |
| Product Code ACT300163 | LM-AIR1800-L350×0.4 |
| Dimensions (H×W×D) ACT300159 | 395×305×285mm |
| Dimensions (H×W×D) ACT300161 | 395×305×285mm |
| Dimensions (H×W×D) ACT300162 | 395×305×285mm |
| Dimensions (H×W×D) ACT300163 | 395×305×285mm |
| Max Weight ACT300159 | 24kg |
| Max Weight ACT300161 | 24kg |
| Max Weight ACT300162 | 24kg |
| Max Weight ACT300163 | 24kg |
| CW-nominal Output Power ACT300159 | 5000W |
| CW-nominal Output Power ACT300161 | 9000W |
| CW-nominal Output Power ACT300162 | 10000W |
| CW-nominal Output Power ACT300163 | 18000W |
| Wavelength ACT300159 | 940nm |
| Wavelength ACT300161 | 940nm |
| Wavelength ACT300162 | 940nm |
| Wavelength ACT300163 | 940nm |
| Wavelength Tolerance (±) ACT300159 | 10nm |
| Wavelength Tolerance (±) ACT300161 | 10nm |
| Wavelength Tolerance (±) ACT300162 | 10nm |
| Wavelength Tolerance (±) ACT300163 | 10nm |
| Beam Length: Beam Size at Working Distance ACT300159 | 155mm |
| Beam Length: Beam Size at Working Distance ACT300161 | 155mm |
| Beam Length: Beam Size at Working Distance ACT300162 | 350mm |
| Beam Length: Beam Size at Working Distance ACT300163 | 350mm |
| Beam Length: Line Tolerance (±) ACT300159 | 5mm |
| Beam Length: Line Tolerance (±) ACT300161 | 5mm |
| Beam Length: Line Tolerance (±) ACT300162 | 5mm |
| Beam Length: Line Tolerance (±) ACT300163 | 5mm |
| Beam Length: Beam Profile ACT300159 | TopHat |
| Beam Length: Beam Profile ACT300161 | TopHat |
| Beam Length: Beam Profile ACT300162 | TopHat |
| Beam Length: Beam Profile ACT300163 | TopHat |
| Beam Length: Measured at Level ACT300159 | FW85% |
| Beam Length: Measured at Level ACT300161 | FW85% |
| Beam Length: Measured at Level ACT300162 | FW85% |
| Beam Length: Measured at Level ACT300163 | FW85% |
| Beam Width: Beam Size at Working Distance ACT300159 | 400μm |
| Beam Width: Beam Size at Working Distance ACT300161 | 400μm |
| Beam Width: Beam Size at Working Distance ACT300162 | 400μm |
| Beam Width: Beam Size at Working Distance ACT300163 | 400μm |
| Beam Width: Line Tolerance (±) ACT300159 | 50μm |
| Beam Width: Line Tolerance (±) ACT300161 | 50μm |
| Beam Width: Line Tolerance (±) ACT300162 | 50μm |
| Beam Width: Line Tolerance (±) ACT300163 | 50μm |
| Beam Width: Beam Profile ACT300159 | Gaussian |
| Beam Width: Beam Profile ACT300161 | Gaussian |
| Beam Width: Beam Profile ACT300162 | Gaussian |
| Beam Width: Beam Profile ACT300163 | Gaussian |
| Beam Width: Measured at Level ACT300159 | FW1/e² |
| Beam Width: Measured at Level ACT300161 | FW1/e² |
| Beam Width: Measured at Level ACT300162 | FW1/e² |
| Beam Width: Measured at Level ACT300163 | FW1/e² |
| Uniformity ACT300159 | >90% |
| Uniformity ACT300161 | >90% |
| Uniformity ACT300162 | >90% |
| Uniformity ACT300163 | >90% |
| Working Distance ACT300159 | >180mm |
| Working Distance ACT300161 | >180mm |
| Working Distance ACT300162 | >180mm |
| Working Distance ACT300163 | >180mm |
| Chiller Type ACT300159 | Air-Water |
| Chiller Type ACT300161 | Air-Water |
| Chiller Type ACT300162 | Air-Water |
| Chiller Type ACT300163 | Air-Water |
| Cooling Capacity ACT300159 | >6000W |
| Cooling Capacity ACT300161 | >10000W |
| Cooling Capacity ACT300162 | >12000W |
| Cooling Capacity ACT300163 | >24000W |
| Laser Circuit Water Pressure ACT300159 | 3.5bar |
| Laser Circuit Water Pressure ACT300161 | 3.5bar |
| Laser Circuit Water Pressure ACT300162 | 3.5bar |
| Laser Circuit Water Pressure ACT300163 | 3.5bar |
| Laser Circuit Water Flow ACT300159 | 15L/min |
| Laser Circuit Water Flow ACT300161 | 27L/min |
| Laser Circuit Water Flow ACT300162 | 30L/min |
| Laser Circuit Water Flow ACT300163 | 45L/min |
| Laser Circuit Water Type ACT300159 | DI Water |
| Laser Circuit Water Type ACT300161 | DI Water |
| Laser Circuit Water Type ACT300162 | DI Water |
| Laser Circuit Water Type ACT300163 | DI Water |
| Operating Temperature ACT300159 | 15~35°C |
| Operating Temperature ACT300161 | 15~35°C |
| Operating Temperature ACT300162 | 15~35°C |
| Operating Temperature ACT300163 | 15~35°C |
| Storage Temperature ACT300159 | 15~60°C |
| Storage Temperature ACT300161 | 15~60°C |
| Storage Temperature ACT300162 | 15~60°C |
| Storage Temperature ACT300163 | 15~60°C |
Applications
Key Features
Datasheet
Supplier Information
Related Products
-
High-performance silicon wafers
Semiconductor Manufacturing Equipment
Ybsemi-Solution
Wafer Size: 150-200mm Resistivity Range: <0.001Ωcm to >10kΩcm Device Layer Thickness: 1μm to >200μm
Okmetic specializes in advanced silicon wafers tailored for MEMS, RF, and power devices, offering high resistivity and customizable solutions.
-
Wafer Scribing Machine
Semiconductor Manufacturing Equipment
Uwlaser
: Parameter value : ≤ 10μm (factory parallelism/flatness/verticality/right angle) : ±0.5μm
-
Wafer Cleaving System
Semiconductor Manufacturing Equipment
Uwlaser
: 2 inch-6 inch wafer : About 2 dollars/s : ±3μm
-
Laser Wafer Modification Cutting System
Semiconductor Manufacturing Equipment
Uwlaser
: 4inch, 6inch, 8inch, 12inch (optional) : Maximum 1000mm/s : wafer Frame
-
Fully Automatic Optoelectronic Device Die Bonding and Assembly System
Semiconductor Manufacturing Equipment
Ybsemi-Solution
Equipment Type: Fully automatic die bonding and assembly system Configuration: Dual-station enclosed chamber with front double doors Observation Window: Large transparent safety windows on processing chamber
This is a fully automatic high-precision die bonding and assembly system designed for optoelectronic device manufacturing. Based on the product image, the equipment features a dual-station enclosed processing chamber with large observation windows, dual HMI touchscreen control panels, multi-color tower status lights, and automated cassette/magazine loading for substrates or wafers. The system integrates precision motion control, vision alignment, and automated material handling to achieve high-throughput, high-accuracy die attach, component placement, and packaging processes for photonic and semiconductor devices. The enclosed clean-room-compatible design with safety interlocks ensures process stability, particle control, and operator safety during continuous production.
Related Articles
Electro-optic deflectors (EODs) are optical devices used to steer or deflect light beams by applying an electric field to a specialized optical crystal. Unlike mechanical beam steering systems that rely on moving mirrors, electro-optic deflectors enable high-speed, non-mechanical beam control with exceptional precision and responsiveness. They are widely used in laser scanning, optical communications, microscopy, laser printing, spectroscopy, and scientific research, where rapid and accurate laser beam positioning is essential.
An infrared transmitter (IR transmitter) is a basic electronic component that sends invisible infrared light signals for short-range wireless control. It is widely used in daily electronics, smart home devices, and industrial equipment due to its low cost, low power consumption, and stable performance.
Shanghai Connet Laser Technology Co., Ltd. focuses on technological innovation, delivering cutting-edge photonic products & solutions for industrial lasers, LiDAR, fiber optic sensing, coherent telecom, cold atom physics and precision spectroscopy research & mass manufacturing.
Wuhan Optical Valley Interlink Technology Co., Ltd. was founded in 2013 by a technical team from Huazhong University of Science and Technology.
Loading...
Name
Phone
Organization
Use Case
Database Platform