TruPlasma RF Series 1000/3000
The TruPlasma RF Series 1000/3000 provides high-frequency generators designed for plasma applications, offering stable output power, high control accuracy, and exceptional energy efficiency.
Specification Snapshot
Dimensions (W x H x D)
216x128.5x405mm (3HU)
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Overview
The TruPlasma RF Series 1000/3000 provides high-frequency generators designed for plasma applications, offering stable output power, high control accuracy, and exceptional energy efficiency.
Specifications
| Parameter | Value |
|---|---|
| Output Power Range TruPlasma RF 1001 (G2/13) | 1W...1000W |
| Output Power Range TruPlasma RF 1002 (G2/13) | 1W...2000W |
| Output Power Range TruPlasma RF 1003 (G2/13) | 1W...3000W |
| Maximum Reflected Power | 600W |
| Output Frequency | 13.56MHz ±0.005% |
| Output Impedance | 50Ω |
| Harmonic Signals at Full Nominal Output Power | -40dBc |
| Spurious Signals at Full Nominal Output Power | -50dBc |
| Power Accuracy at 50Ω Load | ±1W or ±1% |
| Fluctuation at 50Ω Load | ±1W |
| Reproducibility of Output Power at 50Ω Load | ±2W or ±1% |
| Regulation Mode | Forward power |
| Regulation Mode | load power |
| Regulation Mode | external voltage |
| Pulse Mode | 1Hz to 50kHz, internal and external signal source |
| Frequency Agility | ±678kHz (±5%) optional |
| Interfaces | Analog: DeviceNet, RS232/485, SystemPort or EtherCAT, Profibus |
| Sync (CEX; pulse; arc) | Yes |
| Mains Voltage | 200-480VAC ±10%, 3 phases + PE |
| Overall Efficiency at Full Nominal Power | 72%-80% (typ.) |
| Power Factor (cosφ) | 0.95 |
| Mains Power Consumption at Full Nominal Power | 1.8kVA-4.3kVA |
| Ambient Temperature | 5°C...35°C |
| Cooling Medium | Water |
| Min. Throughput at 13.56MHz Operation | 4l/min |
| Max. Water Pressure | 7bar |
| Max. Differential Pressure | 1.1bar |
| Protection Class | 30 |
| Dimensions (W x H x D) | 216x128.5x405mm (3HU) |
| Weight | 18kg |
| Standards and Directives | SEMI F47, SEMI S2, UL, CSA, CE, RoHS |
Applications
1. Semiconductor manufacturing 2. Microchip production 3. Solar cell production 4. Flat-panel display production 5. Plasma etching 6. Ion beam source 7. Photoresist plasma incineration 8. Reactive ion etching 9. Atomic layer deposition (ALD) 10. Plasma-enhanced chemical vapor deposition (PECVD) 11. RF sputtering 12. Hard-material and wear-protection layers
Key Features
1. Stable and reproducible processes 2. No restrictions on cable length 3. Robust system construction 4. Excellent efficiency 5. Global installation compatibility 6. Advanced cooling concept 7. Individual process adaptations 8. System integration
Datasheet
Product Datasheet
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Supplier Information
<p>Our task is to further develop and digitally network production technology to make it more economical, precise and future-proof. To do this, we want to plan production and its upstream and downstream workflows more efficiently. This is how we strive to shape the industrial world of the future. As a market and technology leader in machine tools and lasers in the industrial production field, our innovations have impacted almost all walks of life. Our software solutions pave the way for smart factories and enable high-tech processes in industrial electronics.</p>
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