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Photonics Source provides 48 products. Download datasheets, request quotes, and compare function, price, and availability.
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NLD-5700
Chamber Size: Standard Plasma Source: Inductively Coupled Plasma (ICP) Gas Flow Control Range: Wide range Vacuum Level: High vacuum Processing Capability: High throughput -
SOPHI
Inspection Speed: High Resolution: High Dimensions: Compact Power Supply: Standard AC Interface: User-friendly touchscreen -
Unknown
Material: Copper and aluminum Diameter: Varies by model Surface Roughness: ≤0.5nm Flatness: ≤λ/10 -
SOPHI
Dimensions: Customizable Power Requirements: AC200V, 50/60Hz Operating Temperature: 15-30°C Humidity Range: 20-80% (non-condensing) Control System: Touchscreen Interface -
e5
Chamber Size: 500mm x 500mm Vacuum Level: ≤10^-6 Pa Power Supply: AC200V, 50/60Hz Control System: Touchscreen interface Deposition Rate: Up to 10nm/min -
EC-200
Operating Temperature Range: 10°C-40°C Vacuum Level: ≤10⁻⁶ Torr Film Thickness Uniformity: ≤±2% Substrate Size: 200mm Power Consumption: ≤10kW -
SOPHI
Dimensions: Customizable Power Requirements: AC200V, 3-phase, 50/60Hz Polishing Accuracy: Sub-nanometer level Processing Capacity: High throughput Control System: Automated with touch screen interface -
SOPHI
Processing Capacity: High throughput Control System: Automated with touch screen interface Dimensions: Compact design for cleanroom integration Power Requirements: Standard industrial power supply Compatibility: Supports various wafer sizes and materials -
High-Precision Coating System
Coating Uniformity: ≤0.5% Maximum Substrate Size: 300mm Cycle Time: ≤60s Power Consumption: ≤10kW Vacuum Level: ≤10^-6 Torr -
CERC-300
Processing Capacity: 300mm wafers Vacuum Level: High vacuum Control Accuracy: ±0.1% Dimensions: 2000mm x 1500mm x 2500mm Weight: 1500kg -
NLD-570
Dimensions: 1200mm x 1500mm x 1800mm Weight: 1500kg Power Requirements: AC200V, 50/60Hz, 3-phase Gas Flow Control Range: 0-500sccm Vacuum Level: 1x10^-6Pa -
Unknown
Dimensions: Unknown Weight: Unknown Power Consumption: Unknown Operating Temperature: Unknown Input Voltage: Unknown -
Dry Etching System NE-7800
Number of Chambers: 2 Processing Capability: High throughput Etching Precision: High Supported Materials: Various semiconductor materials Control System: Advanced automated control -
NE-7800 Dry Etching System
Number of Chambers: 2 Processing Capability: High-volume production Etching Precision: Sub-micron level Supported Materials: Various semiconductor materials Control System: Advanced automated control -
ULVAC Semiconductor Processing Equipment
Processing Capacity: High throughput Precision: Sub-micron level Compatibility: Supports various wafer sizes Energy Consumption: Optimized for low power usage Dimensions: Compact design for space efficiency -
Unknown
Dimensions: Unknown Power: Unknown Accuracy: Unknown -
IH-860 DISC
Working Pressure: 1×10^-3Pa Target Size: 8 inches Substrate Size: 3.5 inches Deposition Rate: 1.2nm/s Film Thickness Uniformity: ±2% -
CS-200
Operating Temperature: 15°C-30°C Power Requirements: AC200V, 50/60Hz Chamber Dimensions: 500mm x 500mm x 500mm Deposition Rate: 0.1nm/s-10nm/s Substrate Size: 200mm x 200mm -
DMS-300
Working Pressure: 1×10^-3 Pa Target Size: 300mm Deposition Rate: Up to 10nm/min Substrate Size: Up to 200mm Power Type: DC/RF -
DMS-700
Working Pressure: 1×10^-3 Pa Target Size: 200mm Deposition Rate: 1nm/s Substrate Size: 150mm Power Supply: 10kW