Thin-film cutting
The precision laser cutting system efficiently and cleanly cuts films and thin sheets. High-precision noncontact laser processing cuts battery separators, cover films, blue films and other organic films without deformation, including complex patterns such as precise windows in blue films. It also rapidly cuts thin metal sheets with smooth, burr-free edges. Processing creates no mechanical stress or dust contamination and supports roll-to-roll or sheet-to-sheet production in new energy, electronic packaging and precision components, improving quality and productivity.
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Overview
The precision laser cutting system efficiently and cleanly cuts films and thin sheets. High-precision noncontact laser processing cuts battery separators, cover films, blue films and other organic films without deformation, including complex patterns such as precise windows in blue films. It also rapidly cuts thin metal sheets with smooth, burr-free edges. Processing creates no mechanical stress or dust contamination and supports roll-to-roll or sheet-to-sheet production in new energy, electronic packaging and precision components, improving quality and productivity.
Specifications
| Parameter | Value |
|---|---|
| Cutting speed [Multilayer separator cutting] | 100mm/s~300mm/s |
| Thermal effect [Multilayer separator cutting] | ≤300μm |
| Cutting speed [Double-layer separator cutting] | 500mm/s~5000mm/s |
| Thermal effect [Double-layer separator cutting] | ≤100μm |
Applications
Cutting battery separators; cutting cover films; opening windows in blue film; cutting organic thin films; cutting thin metal sheets.
Key Features
Noncontact cutting without deformation; high-precision, clean window opening; broad material compatibility; no dust or burrs; flexible programmable processing; supports efficient roll-to-roll production.
Datasheet
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Supplier Information
Founded in 2021 by Dr. Bao Qiaoliang, a globally highly cited scientist, Klight Laser has grown into a national high-tech enterprise. The company focuses on the R&D and production of ultrafast ultraviolet and deep ultraviolet lasers (wavelengths: 355nm/266nm/213nm/193nm), providing deep ultraviolet light sources for semiconductor wafer defect detection (particle detection, bright/dark field detection) or mask inspection equipment. Klight's high-repetition-rate picosecond deep ultraviolet lasers fully match the technical specifications of international counterparts, independently developed with multiple core patented technologies and supplemented by intelligent control systems, offering customized light source matching services for domestic wafer inspection equipment integrators. Additionally, the company provides customized flexible micro-machining solutions in the form of laser modules, and has expanded into multiple application fields such as new energy, pan-semiconductor, and medical aesthetics.
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