Knight Series Picosecond infrared 1064 nm Laser Knight-NIR-50
Knight series industrial picosecond lasers offer greater stability and durability than conventional solid-state picosecond lasers. A solid-state amplifier ensures high-peak-power output. All products undergo high-temperature burn-in, thermal shock and vibration reliability testing to ensure power stability and long-term reliability under 7/24 industrial production conditions. Maximum output reaches 200 W, with pulse energy up to 400μJ. Applications include precision machining of hard, brittle materials such as glass and ceramics, precision ceramic marking, and cutting and cleaning battery electrodes.
Specification Snapshot
Center Wavelength
1064 nm
Average Power
50 W
Pulse Width
10~15 ps
Repetition Rate
50~1000 kHz
Operating Temperature
+10~+35 °C
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Overview
Knight series industrial picosecond lasers offer greater stability and durability than conventional solid-state picosecond lasers. A solid-state amplifier ensures high-peak-power output. All products undergo high-temperature burn-in, thermal shock and vibration reliability testing to ensure power stability and long-term reliability under 7/24 industrial production conditions. Maximum output reaches 200 W, with pulse energy up to 400μJ. Applications include precision machining of hard, brittle materials such as glass and ceramics, precision ceramic marking, and cutting and cleaning battery electrodes.
Specifications
| Parameter | Value |
|---|---|
| Center Wavelength | 1064 nm |
| Average Power | 50 W |
| Pulse Width | 10~15 ps |
| Single-pulse energy [@500 kHz;@500 kHz)] | 100(@500 kHz) |
| Peak Power [@500 kHz;@500 kHz)] | 10(@500 kHz) |
| Repetition Rate | 50~1000 kHz |
| Power stability [RMS] | <1 % |
| Pulse Stability [RMS] | <1 % |
| Beam quality M2 | ≤1.3 |
| Spot diameter [1/e²] | 2.0±0.3 mm |
| Spot roundness | >90 % |
| Polarization method | Horizontal |
| Polarization ratio | >100:1 |
| Optical output power adjustment range | 0~100 % |
| Frequency following function | Supported |
| Operating Voltage [50/60 Hz] | 100~240(50/60 Hz) |
| Communication Protocol | RS-232, Ethernet, USB |
| Cooling method | Water cooling Water |
| Operating Temperature | +10~+35 °C |
| Shipping dimensions [W×D×H] | 700 mm × 500 mm × 200 mm |
| Shipping weight | 70~80 kg |
| Shipping temperature | -20~+60°C |
| Shipping relative humidity | 10~80 % |
Applications
Processing hard, brittle materials through high-precision marking, microdrilling and cutting; LED wafer dicing and cutting; cutting LCD/OLED display panels; cleaning and cutting lithium-battery electrode sheets; processing hard, brittle materials through high-precision marking, microdrilling and cutting; LED wafer dicing and cutting; cutting LCD/OLED display panels; dicing; liquid-crystal-display cutting; multiple-tab cutting; cathode cleaning; silicon-wafer dicing; traction-battery tab forming; anode cleaning.
Key Features
Integrated design; independently developed high-frequency seed source; proprietary hardware and software control system; constant power output with multistage compensation; adaptive pointing-stabilization system; real-time monitoring and recording of multiphysics data; remote diagnostics and predictive maintenance; good stability and consistency
Datasheet
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Supplier Information
Founded in 2021 by Dr. Bao Qiaoliang, a globally highly cited scientist, Klight Laser has grown into a national high-tech enterprise. The company focuses on the R&D and production of ultrafast ultraviolet and deep ultraviolet lasers (wavelengths: 355nm/266nm/213nm/193nm), providing deep ultraviolet light sources for semiconductor wafer defect detection (particle detection, bright/dark field detection) or mask inspection equipment. Klight's high-repetition-rate picosecond deep ultraviolet lasers fully match the technical specifications of international counterparts, independently developed with multiple core patented technologies and supplemented by intelligent control systems, offering customized light source matching services for domestic wafer inspection equipment integrators. Additionally, the company provides customized flexible micro-machining solutions in the form of laser modules, and has expanded into multiple application fields such as new energy, pan-semiconductor, and medical aesthetics.
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