TL-1N-1310
Yingxun Xinguang's wide-range continuously swept-frequency laser module combines silicon photonics, ECL external-cavity laser technology, advanced hybrid chip integration and precision circuit control. Features include broad mode-hop-free continuous sweep range, high sweep speed and linearity, narrow linewidth, low noise, stable wavelength and optical power, wide operating temperature range, small size, low weight, low power consumption, high reliability and easy operation.
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Overview
Yingxun Xinguang's wide-range continuously swept-frequency laser module combines silicon photonics, ECL external-cavity laser technology, advanced hybrid chip integration and precision circuit control. Features include broad mode-hop-free continuous sweep range, high sweep speed and linearity, narrow linewidth, low noise, stable wavelength and optical power, wide operating temperature range, small size, low weight, low power consumption, high reliability and easy operation.
Specifications
| Parameter | Value |
|---|---|
| Continuous Frequency-Sweep Range | 0~10GHz |
| Frequency Sweep Rate | 0~300kHz |
| Frequency-Sweep Linearity | ~99.9999% |
| Lorentzian Linewidth | ~10kHz |
| Output optical power | ~20mW |
Applications
Data-center optical-link inspection, CPO/chip measurement, optical transmission, high-precision industrial metrology, OFDR sensing, medical photonics, FMCW measurement and high-frequency vibration/ultrasonic monitoring.
Key Features
Silicon photonic integration technology; wide-range continuous frequency sweeping without mode hops; exceptionally high sweep linearity; ultranarrow linewidth.
Datasheet
Product Datasheet
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Supplier Information
Inxuntech Technology Co., Ltd. is located in Zhuhai, China, and is a hard-tech innovative enterprise with leading silicon photonics chip technology. The core technical team is composed of chip experts from top overseas chip companies and elite talents from international high-tech enterprises.
The company masters leading CMOS silicon photonics and photonic integrated circuit (PIC) technologies. Based on vertical technology integration with independent intellectual property rights, it possesses complete end-to-end chip product technologies and development capabilities including silicon photonics and III-V chip design, tape-out, integrated packaging, and testing. It also has core hardware and software technologies and key mass production process capabilities in optoelectronic packaging, core devices, optoelectronic systems, and AI algorithms.
The company's current products include core optoelectronic devices, optoelectronic integrated modules, and subsystems based on silicon photonics technology. With disruptive technical solutions, it provides underlying core support for many high-value emerging applications (AI data centers, CPO/OCS, precision measurement, next-generation optical sensing, FMCW LiDAR, medical photonics, optical quantum, etc.), and has been applied at scale by leading industry customers at home and abroad.
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