MPI TS3000

MPI TS3000

Supplier
Ybsemi-Solution
Part Number
MPI TS3000
Category
Probe Station
Origin
China

The MPI TS3000 is a 300 mm automated probe system designed for product engineering and RF, mmW, load-pull measurements. It features advanced IceFreeEnvironment™ technology for precise testing at negative temperatures, integrated controls, and ergonomic design.

Specification Snapshot
Probe Platen Chuck Top to Platen Top
Min. 28mm
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Overview

The MPI TS3000 is a 300 mm automated probe system designed for product engineering and RF, mmW, load-pull measurements. It features advanced IceFreeEnvironment™ technology for precise testing at negative temperatures, integrated controls, and ergonomic design.

Specifications

ParameterValue
Chuck XY Stage Travel Range310mm×310mm
Chuck XY Stage Resolution0.5μm
Chuck XY Stage Accuracy±2.0μm
Chuck XY Stage Repeatability±1.0μm
Chuck XY Stage Speed10mm/sec to 50mm/sec
Chuck Z Stage Travel Range30mm
Chuck Z Stage Resolution0.2μm
Chuck Z Stage Accuracy±2.0μm
Chuck Z Stage Repeatability±1.0μm
Chuck Z Stage Speed10mm/sec to 50mm/sec
Chuck Theta Stage Travel Range±5°
Chuck Theta Stage Resolution0.0001°
Chuck Theta Stage Accuracy<2.0μm
Chuck Theta Stage Repeatability<1.0μm
Microscope Movement XYZ Stage Travel Range50mm×50mm×140mm
Microscope Movement Resolution X-Y Axis1μm
Microscope Movement Accuracy X-Y Axis≤5μm
Microscope Movement Resolution Z Axis0.05μm
Microscope Movement Accuracy Z Axis≤4μm
Probe Platen MaterialNickel plated steel
Probe Platen Chuck Top to Platen TopMin. 28mm
Probe Platen CoolingFully integrated CDA cooling
Probe Platen ConfigurationProbe card holder 4.5×11" and/or MicroPositioners
Probe Platen Max. No. of MicroPositioners10x DC MicroPositioners or 4x DC + 4x HF MicroPositioner Setup
Probe Platen RF MicroPositioner MountingMagnetic with guided rail
Probe Platen DC MicroPositioner MountingMagnetic
Thermal Chuck ConnectivityKelvin Triax (f)
Thermal Chuck Temperature Control MethodCooling air/Resistance heater
Thermal Chuck CoolantAir (user supplied)
Thermal Chuck Temperature Stability±0.5°C
Thermal Chuck Temperature Accuracy0.1°C
Thermal Chuck Surface Flatness<±12μm
Thermal Chuck Max Voltage Between Force-to-GND600V DC
Thermal Chuck Max Voltage Between Force-to-Guard100V DC
Thermal Chuck Heating Rates35 to 200°C <15min, 35 to 300°C <25min
Thermal Chuck Cooling Rates300 to 35°C <35min, 300 to 25°C <28min
System Dimensions1400mm×1115mm×1550mm
System Weight850kg
System Controller CPUIntel Core i7-7700, 3.6GHz, 8M Cache
System Controller RAMDDR4 2400MHz 16GB
System Controller StorageSSD 500GB
System Controller Operating SystemWindows 10 Professional
System Controller Power460W
System Controller LANOne internal and one external TCP/IP ports
System Controller USB PortsInternal (on PC) x3, external x1
System Controller GPIB InterfaceOptional
Facility Requirements Power100-240V AC nominal, 50/60Hz
Facility Requirements Vacuum-0.9bar
Facility Requirements Compressed Air6.0bar

Applications

1. DC-IV/DC-CV/Pulsed-IV applications 2. RF, mmW, load-pull applications & 4-port setup 3. IC design validation and failure analysis in wide temperature range (-60 to 300°C) 4. Wafer level reliability testing

Key Features

1. Advanced IceFreeEnvironment™ technology for precise testing at negative temperatures 2. Integrated controls for faster and safer operation 3. Ergonomic design for easy operation and reduced footprint 4. High precision and repeatability in measurements 5. Supports film-frame probing

Datasheet

Product Datasheet
PDF
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Supplier Information

Yb
Ybsemi-Solution
View Supplier →
<p>Yingbo Scientific Instruments (Shanghai) Co., Ltd. is an enterprise focused on providing comprehensive solutions for semiconductor wafer-level testing systems, micro-nano science and other fields. It mainly provides advanced semiconductor testing systems and micro-nano scientific instruments and equipment to universities, scientific research institutes and enterprises and institutions, and is committed to bringing scientific research products with market prospects to the market.</p><p><br></p><p><br></p><p> &nbsp; &nbsp; &nbsp; At present, the company has become one of the few domestic companies that provides professional scientific instruments such as semiconductor wafer-level testing systems and micro-nano processing. In the fields of semiconductor wafer-level testing system solutions, micro-nano processing equipment, micro-nano characterization equipment, micro-nano field consumables, micro-nano processing and testing, micro-nano peripheral products and other related fields, the company has an experienced and highly skilled team that can excellently complete all-round services before, during and after sales. The company is headquartered in Shanghai, and has offices in Beijing and Shenzhen. It has established 8 after-sales service outlets in Wuhan, Xi'an, Chengdu, Hefei, Shenyang, Nanjing, Xiamen, Xuzhou and other places. The outlets across the country provide customers with a large number of high-quality equipment and after-sales services, and have won a good reputation and reputation in the semiconductor technology service industry.</p><p><br></p><p> &nbsp; &nbsp; &nbsp; The company adheres to the value concepts of innovation, integrity, professionalism and efficiency, and provides high-quality equipment and technical services to partners. In the future, the company will continue to recommend the introduction of innovative and efficient product instruments and contribute a small amount to the development of the motherland's semiconductor science industry!</p>

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