MPI TS3000
The MPI TS3000 is a 300 mm automated probe system designed for product engineering and RF, mmW, load-pull measurements. It features advanced IceFreeEnvironment™ technology for precise testing at negative temperatures, integrated controls, and ergonomic design.
Specification Snapshot
Probe Platen Chuck Top to Platen Top
Min. 28mm
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Overview
The MPI TS3000 is a 300 mm automated probe system designed for product engineering and RF, mmW, load-pull measurements. It features advanced IceFreeEnvironment™ technology for precise testing at negative temperatures, integrated controls, and ergonomic design.
Specifications
| Parameter | Value |
|---|---|
| Chuck XY Stage Travel Range | 310mm×310mm |
| Chuck XY Stage Resolution | 0.5μm |
| Chuck XY Stage Accuracy | ±2.0μm |
| Chuck XY Stage Repeatability | ±1.0μm |
| Chuck XY Stage Speed | 10mm/sec to 50mm/sec |
| Chuck Z Stage Travel Range | 30mm |
| Chuck Z Stage Resolution | 0.2μm |
| Chuck Z Stage Accuracy | ±2.0μm |
| Chuck Z Stage Repeatability | ±1.0μm |
| Chuck Z Stage Speed | 10mm/sec to 50mm/sec |
| Chuck Theta Stage Travel Range | ±5° |
| Chuck Theta Stage Resolution | 0.0001° |
| Chuck Theta Stage Accuracy | <2.0μm |
| Chuck Theta Stage Repeatability | <1.0μm |
| Microscope Movement XYZ Stage Travel Range | 50mm×50mm×140mm |
| Microscope Movement Resolution X-Y Axis | 1μm |
| Microscope Movement Accuracy X-Y Axis | ≤5μm |
| Microscope Movement Resolution Z Axis | 0.05μm |
| Microscope Movement Accuracy Z Axis | ≤4μm |
| Probe Platen Material | Nickel plated steel |
| Probe Platen Chuck Top to Platen Top | Min. 28mm |
| Probe Platen Cooling | Fully integrated CDA cooling |
| Probe Platen Configuration | Probe card holder 4.5×11" and/or MicroPositioners |
| Probe Platen Max. No. of MicroPositioners | 10x DC MicroPositioners or 4x DC + 4x HF MicroPositioner Setup |
| Probe Platen RF MicroPositioner Mounting | Magnetic with guided rail |
| Probe Platen DC MicroPositioner Mounting | Magnetic |
| Thermal Chuck Connectivity | Kelvin Triax (f) |
| Thermal Chuck Temperature Control Method | Cooling air/Resistance heater |
| Thermal Chuck Coolant | Air (user supplied) |
| Thermal Chuck Temperature Stability | ±0.5°C |
| Thermal Chuck Temperature Accuracy | 0.1°C |
| Thermal Chuck Surface Flatness | <±12μm |
| Thermal Chuck Max Voltage Between Force-to-GND | 600V DC |
| Thermal Chuck Max Voltage Between Force-to-Guard | 100V DC |
| Thermal Chuck Heating Rates | 35 to 200°C <15min, 35 to 300°C <25min |
| Thermal Chuck Cooling Rates | 300 to 35°C <35min, 300 to 25°C <28min |
| System Dimensions | 1400mm×1115mm×1550mm |
| System Weight | 850kg |
| System Controller CPU | Intel Core i7-7700, 3.6GHz, 8M Cache |
| System Controller RAM | DDR4 2400MHz 16GB |
| System Controller Storage | SSD 500GB |
| System Controller Operating System | Windows 10 Professional |
| System Controller Power | 460W |
| System Controller LAN | One internal and one external TCP/IP ports |
| System Controller USB Ports | Internal (on PC) x3, external x1 |
| System Controller GPIB Interface | Optional |
| Facility Requirements Power | 100-240V AC nominal, 50/60Hz |
| Facility Requirements Vacuum | -0.9bar |
| Facility Requirements Compressed Air | 6.0bar |
Applications
1. DC-IV/DC-CV/Pulsed-IV applications 2. RF, mmW, load-pull applications & 4-port setup 3. IC design validation and failure analysis in wide temperature range (-60 to 300°C) 4. Wafer level reliability testing
Key Features
1. Advanced IceFreeEnvironment™ technology for precise testing at negative temperatures 2. Integrated controls for faster and safer operation 3. Ergonomic design for easy operation and reduced footprint 4. High precision and repeatability in measurements 5. Supports film-frame probing
Datasheet
Product Datasheet
PDF
Supplier Information
<p>Yingbo Scientific Instruments (Shanghai) Co., Ltd. is an enterprise focused on providing comprehensive solutions for semiconductor wafer-level testing systems, micro-nano science and other fields. It mainly provides advanced semiconductor testing systems and micro-nano scientific instruments and equipment to universities, scientific research institutes and enterprises and institutions, and is committed to bringing scientific research products with market prospects to the market.</p><p><br></p><p><br></p><p> At present, the company has become one of the few domestic companies that provides professional scientific instruments such as semiconductor wafer-level testing systems and micro-nano processing. In the fields of semiconductor wafer-level testing system solutions, micro-nano processing equipment, micro-nano characterization equipment, micro-nano field consumables, micro-nano processing and testing, micro-nano peripheral products and other related fields, the company has an experienced and highly skilled team that can excellently complete all-round services before, during and after sales. The company is headquartered in Shanghai, and has offices in Beijing and Shenzhen. It has established 8 after-sales service outlets in Wuhan, Xi'an, Chengdu, Hefei, Shenyang, Nanjing, Xiamen, Xuzhou and other places. The outlets across the country provide customers with a large number of high-quality equipment and after-sales services, and have won a good reputation and reputation in the semiconductor technology service industry.</p><p><br></p><p> The company adheres to the value concepts of innovation, integrity, professionalism and efficiency, and provides high-quality equipment and technical services to partners. In the future, the company will continue to recommend the introduction of innovative and efficient product instruments and contribute a small amount to the development of the motherland's semiconductor science industry!</p>
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