TS150 Manual Probe System
The TS150 is a 150 mm manual probe system designed for accurate and reliable DC/CV and RF measurements, offering high precision and flexibility for various applications.
Specification Snapshot
Total Travel Range
180x230mm (7.1x9.1in)
Fine Travel Range
25x25mm fine micrometer control
Microscope Movement Range
25x25mm (1x1in)
Microscope Resolution
N/A
Probe Platen Dimensions
See drawing
Chuck Top to Platen Top
Min. 28mm
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Overview
The TS150 is a 150 mm manual probe system designed for accurate and reliable DC/CV and RF measurements, offering high precision and flexibility for various applications.
Specifications
| Parameter | Value |
|---|---|
| Total Travel Range | 180x230mm (7.1x9.1in) |
| Fine Travel Range | 25x25mm fine micrometer control |
| Fine Travel Resolution | <1.0μm (0.04mils)@500μm/rev |
| Planarity | <10μm |
| Theta Travel (Standard) | 360° |
| Theta Travel (Fine) | ±5.0° |
| Theta Resolution | 7.5x10^-3 gradient |
| Movement | Puck controlled air bearing stage |
| Microscope Movement Range | 25x25mm (1x1in) |
| Microscope Resolution | N/A |
| Scope Lift | Manual, tilt-back |
| Microscope Movement | Air bearing control |
| Microscope Movement | fixed by vacuum |
| Probe Platen Material | Nickel plated steel |
| Probe Platen Dimensions | See drawing |
| Chuck Top to Platen Top | Min. 28mm |
| Max. No of MicroPositioners | 10 DC and 4 RF |
| Platen Lift Control | 3 positions - contact (0), separation (300μm), and loading (3mm) |
| Platen Z-Height Adjustment Range | Max. 20mm (0.8in) |
| Separation Repeatability | <1μm (0.04mils) by automated control |
| RF MicroPositioner Mounting | Magnetic with guided rail |
| DC MicroPositioner Mounting | Magnetic |
| Thermal Isolation | 300°C thermal isolation depends on chuck configuration |
| Non-Thermal Chuck Connectivity 1 | Coaxial chuck: Coax BNC (f) |
| Non-Thermal Chuck Connectivity 2 | Triaxial chuck: Kelvin Triax |
| Non-Thermal Chuck Diameter | 160mm |
| Non-Thermal Chuck Material | Stainless steel |
| Non-Thermal Chuck Surface | Planar with centric engraved vacuum grooves |
| Non-Thermal Chuck Vacuum Grooves Sections (Diameter) | 3, 27, 45, 69, 93, 117, 141mm |
| Non-Thermal Chuck Vacuum Actuation | Multizone control - All connected in meander shape, center hole in 3mm diameter |
| Supported DUT Sizes | Single DUTs down to 4x4mm size or wafers 50mm (2in) thru 150mm (6in) |
| Surface Planarity | ≤5μm |
| Rigidity | <15μm/10N@edge |
| Electrical Specification (Coax) Operation Voltage | In accordance with EC 61010, certificates for higher voltages available upon request |
| Electrical Specification (Coax) Maximum Voltage | 500V DC |
| Electrical Specification (Coax) Isolation | >2GΩ |
| Electrical Specification (Triax) Chuck Isolation | >100GΩ |
| Electrical Specification (Triax) Force to Guard | >100GΩ |
| Electrical Specification (Triax) Guard to Shield | >10GΩ |
| Electrical Specification (Triax) Force to Shield | >50GΩ |
| Thermal Chuck Connectivity | Coax BNC (f) |
| Temperature Control Method | Cooling air/Resistance heater |
| Coolant | Air (user supplied) |
| Smallest Temperature Selection Step | 0.1°C |
| Chuck Temperature Display Resolution | 0.1°C |
| Temperature Stability | ±0.5°C |
| Temperature Accuracy | ±1°C |
| Control Method | DC/PID |
| Interfaces | RS232C |
| Chuck Surface Plating | Nickel plated with pinhole surface |
| Temperature Sensor | Pt100 1/3DIN |
| Temperature Uniformity | <±1°C |
| Surface Flatness and Base Parallelism | <±15μm |
| Heating and Cooling Rates | 35 to 150°C <10min, 150 to 35°C <15min |
| Electrical Isolation | >0.5TΩ@25°C |
| Leakage @10V | N/A |
| Capacitance | <750pF |
| Maximum Voltage Between Chuck Top and GND | 500V DC |
Applications
1. Device characterization and modeling 2. Wafer level reliability testing 3. Failure analysis 4. IC engineering 5. MEMS testing 6. High power measurements
Key Features
1. Stable bridge for high-quality optics 2. Linear Z lift for easy reconfiguration 3. Seamless integration of thermal controller touchscreen panel 4. Modular chucks with wide temperature range 5. Supports up to 10 DC and 4 RF positioners 6. Puck controlled air bearing stage for single-handed operation
Datasheet
Product Datasheet
PDF
Supplier Information
<p>Yingbo Scientific Instruments (Shanghai) Co., Ltd. is an enterprise focused on providing comprehensive solutions for semiconductor wafer-level testing systems, micro-nano science and other fields. It mainly provides advanced semiconductor testing systems and micro-nano scientific instruments and equipment to universities, scientific research institutes and enterprises and institutions, and is committed to bringing scientific research products with market prospects to the market.</p><p><br></p><p><br></p><p> At present, the company has become one of the few domestic companies that provides professional scientific instruments such as semiconductor wafer-level testing systems and micro-nano processing. In the fields of semiconductor wafer-level testing system solutions, micro-nano processing equipment, micro-nano characterization equipment, micro-nano field consumables, micro-nano processing and testing, micro-nano peripheral products and other related fields, the company has an experienced and highly skilled team that can excellently complete all-round services before, during and after sales. The company is headquartered in Shanghai, and has offices in Beijing and Shenzhen. It has established 8 after-sales service outlets in Wuhan, Xi'an, Chengdu, Hefei, Shenyang, Nanjing, Xiamen, Xuzhou and other places. The outlets across the country provide customers with a large number of high-quality equipment and after-sales services, and have won a good reputation and reputation in the semiconductor technology service industry.</p><p><br></p><p> The company adheres to the value concepts of innovation, integrity, professionalism and efficiency, and provides high-quality equipment and technical services to partners. In the future, the company will continue to recommend the introduction of innovative and efficient product instruments and contribute a small amount to the development of the motherland's semiconductor science industry!</p>
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