TS150 Manual Probe System

TS150 Manual Probe System

Supplier
Ybsemi-Solution
Part Number
TS150 Manual Probe System
Category
Probe Station
Origin
China

The TS150 is a 150 mm manual probe system designed for accurate and reliable DC/CV and RF measurements, offering high precision and flexibility for various applications.

Specification Snapshot
Total Travel Range
180x230mm (7.1x9.1in)
Fine Travel Range
25x25mm fine micrometer control
Microscope Movement Range
25x25mm (1x1in)
Microscope Resolution
N/A
Probe Platen Dimensions
See drawing
Chuck Top to Platen Top
Min. 28mm
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Overview

The TS150 is a 150 mm manual probe system designed for accurate and reliable DC/CV and RF measurements, offering high precision and flexibility for various applications.

Specifications

ParameterValue
Total Travel Range180x230mm (7.1x9.1in)
Fine Travel Range25x25mm fine micrometer control
Fine Travel Resolution<1.0μm (0.04mils)@500μm/rev
Planarity<10μm
Theta Travel (Standard)360°
Theta Travel (Fine)±5.0°
Theta Resolution7.5x10^-3 gradient
MovementPuck controlled air bearing stage
Microscope Movement Range25x25mm (1x1in)
Microscope ResolutionN/A
Scope LiftManual, tilt-back
Microscope MovementAir bearing control
Microscope Movementfixed by vacuum
Probe Platen MaterialNickel plated steel
Probe Platen DimensionsSee drawing
Chuck Top to Platen TopMin. 28mm
Max. No of MicroPositioners10 DC and 4 RF
Platen Lift Control3 positions - contact (0), separation (300μm), and loading (3mm)
Platen Z-Height Adjustment RangeMax. 20mm (0.8in)
Separation Repeatability<1μm (0.04mils) by automated control
RF MicroPositioner MountingMagnetic with guided rail
DC MicroPositioner MountingMagnetic
Thermal Isolation300°C thermal isolation depends on chuck configuration
Non-Thermal Chuck Connectivity 1Coaxial chuck: Coax BNC (f)
Non-Thermal Chuck Connectivity 2Triaxial chuck: Kelvin Triax
Non-Thermal Chuck Diameter160mm
Non-Thermal Chuck MaterialStainless steel
Non-Thermal Chuck SurfacePlanar with centric engraved vacuum grooves
Non-Thermal Chuck Vacuum Grooves Sections (Diameter)3, 27, 45, 69, 93, 117, 141mm
Non-Thermal Chuck Vacuum ActuationMultizone control - All connected in meander shape, center hole in 3mm diameter
Supported DUT SizesSingle DUTs down to 4x4mm size or wafers 50mm (2in) thru 150mm (6in)
Surface Planarity≤5μm
Rigidity<15μm/10N@edge
Electrical Specification (Coax) Operation VoltageIn accordance with EC 61010, certificates for higher voltages available upon request
Electrical Specification (Coax) Maximum Voltage500V DC
Electrical Specification (Coax) Isolation>2GΩ
Electrical Specification (Triax) Chuck Isolation>100GΩ
Electrical Specification (Triax) Force to Guard>100GΩ
Electrical Specification (Triax) Guard to Shield>10GΩ
Electrical Specification (Triax) Force to Shield>50GΩ
Thermal Chuck ConnectivityCoax BNC (f)
Temperature Control MethodCooling air/Resistance heater
CoolantAir (user supplied)
Smallest Temperature Selection Step0.1°C
Chuck Temperature Display Resolution0.1°C
Temperature Stability±0.5°C
Temperature Accuracy±1°C
Control MethodDC/PID
InterfacesRS232C
Chuck Surface PlatingNickel plated with pinhole surface
Temperature SensorPt100 1/3DIN
Temperature Uniformity<±1°C
Surface Flatness and Base Parallelism<±15μm
Heating and Cooling Rates35 to 150°C <10min, 150 to 35°C <15min
Electrical Isolation>0.5TΩ@25°C
Leakage @10VN/A
Capacitance<750pF
Maximum Voltage Between Chuck Top and GND500V DC

Applications

1. Device characterization and modeling 2. Wafer level reliability testing 3. Failure analysis 4. IC engineering 5. MEMS testing 6. High power measurements

Key Features

1. Stable bridge for high-quality optics 2. Linear Z lift for easy reconfiguration 3. Seamless integration of thermal controller touchscreen panel 4. Modular chucks with wide temperature range 5. Supports up to 10 DC and 4 RF positioners 6. Puck controlled air bearing stage for single-handed operation

Datasheet

Product Datasheet
PDF
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Supplier Information

Yb
Ybsemi-Solution
View Supplier →
<p>Yingbo Scientific Instruments (Shanghai) Co., Ltd. is an enterprise focused on providing comprehensive solutions for semiconductor wafer-level testing systems, micro-nano science and other fields. It mainly provides advanced semiconductor testing systems and micro-nano scientific instruments and equipment to universities, scientific research institutes and enterprises and institutions, and is committed to bringing scientific research products with market prospects to the market.</p><p><br></p><p><br></p><p> &nbsp; &nbsp; &nbsp; At present, the company has become one of the few domestic companies that provides professional scientific instruments such as semiconductor wafer-level testing systems and micro-nano processing. In the fields of semiconductor wafer-level testing system solutions, micro-nano processing equipment, micro-nano characterization equipment, micro-nano field consumables, micro-nano processing and testing, micro-nano peripheral products and other related fields, the company has an experienced and highly skilled team that can excellently complete all-round services before, during and after sales. The company is headquartered in Shanghai, and has offices in Beijing and Shenzhen. It has established 8 after-sales service outlets in Wuhan, Xi'an, Chengdu, Hefei, Shenyang, Nanjing, Xiamen, Xuzhou and other places. The outlets across the country provide customers with a large number of high-quality equipment and after-sales services, and have won a good reputation and reputation in the semiconductor technology service industry.</p><p><br></p><p> &nbsp; &nbsp; &nbsp; The company adheres to the value concepts of innovation, integrity, professionalism and efficiency, and provides high-quality equipment and technical services to partners. In the future, the company will continue to recommend the introduction of innovative and efficient product instruments and contribute a small amount to the development of the motherland's semiconductor science industry!</p>

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