TS2000-IFE
The TS2000-IFE is a 200 mm automated probe system designed for mmW, load-pull, SiPH, and product engineering applications. It offers advanced features such as IceFreeEnvironment™, SENTIO® software, and high precision thermal and non-thermal chucks.
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Overview
Specifications
| Parameter | Value |
|---|---|
| System Dimensions (W×D×H) | 1210×1190×1570mm |
| Weight | 800kg |
| Probe Station Dimensions | 500×1160×970mm |
| Probe Station Weight | 200kg |
| Probe Station Dimensions with DarkBox | 1260×1345×1710mm |
| Probe Station Weight with DarkBox | 895kg |
| XY Stage Travel Range | 220×490mm |
| XY Stage Resolution | 0.2μm |
| XY Stage Accuracy | ±2.0μm |
| XY Stage Repeatability | ±1μm |
| XY Stage Speed | 10mm/s to 50mm/s |
| Z Stage Travel Range | 30mm |
| Z Stage Resolution | 0.2μm |
| Z Stage Accuracy | ±2.0μm |
| Z Stage Repeatability | ±1.0μm |
| Z Stage Speed | 10mm/s to 20mm/s |
| Theta Stage Travel Range | ±5° |
| Theta Stage Resolution | 0.0001° |
| Theta Stage Accuracy | <2.0μm |
| Theta Stage Repeatability | <1.0μm |
| Microscope Travel Range | 50×50mm/100×50mm/200×200mm |
| Microscope Resolution | 1μm |
| Microscope Repeatability | <2μm |
| Microscope Accuracy | <5μm |
| Microscope Z Travel Range | 140mm |
| Microscope Z Resolution | 0.05μm |
| Microscope Z Repeatability | <2μm |
| Microscope Z Accuracy | <4μm |
| Standard Wafer Chuck Diameter | 210mm |
| Standard Wafer Chuck Material | Stainless Steel |
| Standard Wafer Chuck Surface | Planar with centric engraved vacuum grooves |
| Vacuum Grooves Diameter | 3,27,45,69,93,117,141,164,194mm |
| Vacuum Actuation | Multizone control |
| Supported DUT Sizes | 4×4mm to 200mm |
| Surface Planarity | ±5μm |
| Rigidity | <15μm/10N |
| RF Wafer Chuck Diameter | 210mm |
| RF Wafer Chuck Material | Nickel Plated Aluminum |
| RF Wafer Chuck Surface | Planar with 0.5mm diameter holes |
| RF Vacuum Actuation | Manual switch |
| RF Supported DUT Sizes | 4×4mm to 200mm |
| RF Surface Planarity | ±5μm |
| RF Rigidity | <15μm/10N |
| Auxiliary Chuck Quantity | 2 |
| Auxiliary Chuck Position | Front side of main chuck |
| Auxiliary Chuck Material | Ceramic |
| Auxiliary Chuck Surface Planarity | ±5μm |
| Auxiliary Chuck Vacuum Control | Controlled independently |
| Electrical Specification Operation Voltage | 500V DC |
| Electrical Specification Isolation | >2GΩ |
| Electrical Specification Chuck Isolation | Standard Chuck 10V |
| Electrical Specification Force to Guard | >1TΩ |
| Electrical Specification Force to Shield | >5TΩ |
| Thermal Chuck Connectivity | Coax BNC (f) |
| Thermal Chuck Temperature Range | -60°C to 200°C |
| Thermal Chuck Temperature Stability | ±0.5°C |
| Thermal Chuck Temperature Accuracy | ±1°C |
| Thermal Chuck Surface Flatness | <15μm |
| Thermal Chuck Heating Rates | 35 to 150°C <10min |
| Thermal Chuck Cooling Rates | 150 to 35°C <15min |
| Thermal Chuck Electrical Isolation | >0.5TΩ |
| Thermal Chuck Capacitance | <750pF |
| Thermal Chuck Temperature Sensor | Pt100 1/3DIN |
| Thermal Chuck Temperature Uniformity | <±1°C |
| Thermal Chuck Vacuum Distribution | In center for 4×4mm holes |
| Thermal Chuck Control Method | DC/PID |
| System Controller CPU | Intel Core i7-7700, 3.6GHz |
| System Controller RAM | DDR4 2400MHz 16GB |
| System Controller OS | Windows 10 Professional |
| System Controller Storage | SSD 500GB |
| System Controller Power | 460W |
| System Controller LAN | Internal and external TCP/IP ports |
| System Controller USB Ports | Internal x3, External x1 |
| System Controller GPIB Interface | Optional |
Applications
Key Features
Datasheet
Supplier Information
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