TS200-SE Manual Probe System
The TS200-SE is a 200 mm manual probe system designed for accurate and reliable DC/CV and RF measurements across a wide temperature range. It features advanced EMI/RFI shielding, low leakage capabilities, and integrated vibration isolation for precise testing.
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Overview
Specifications
| Parameter | Value |
|---|---|
| XY Stage Travel Range | 225x260mm |
| XY Stage Fine Travel Range | 25x25mm |
| XY Stage Fine Travel Resolution | <1.0μm@500μm/rev |
| XY Stage Planarity | <10μm |
| XY Stage Theta Travel (Standard) | 360° |
| XY Stage Theta Travel (Fine) | ±5° |
| XY Stage Theta Resolution | 7.5x10^-3 gradient |
| XY Stage Movement | Puck controlled air bearing stage |
| Z Stage Travel Range | 5mm |
| Z Stage Fine Travel Resolution | <1.0μm@500μm/rev |
| Z Stage Load Stroke | 20mm, pneumatically |
| Microscope Stage Linear Movement Range | 50x50mm |
| Microscope Stage Resolution | <5μm |
| Microscope Stage Movement | Independently controlled X and Y movement with locking screws |
| Probe Platen Material | Nickel plated steel |
| Probe Platen Dimension | 670x475mm |
| Probe Platen Separation Repeatability | <1μm |
| RF MicroPositioner Mounting | Magnetic with guided rail |
| DC MicroPositioner Mounting | Magnetic |
| 300°C Thermal Isolation | Depending on chuck configuration |
| EMI Shielding | ≥30dB@1kHz to 1MHz |
| Light Attenuation | ≥130dB |
| Spectral Noise Floor | ≤-180dBVrms/rtHz@≤1MHz |
| System AC Noise | ≤5mVp-p@≤1GHz |
| Leakage Current | <0.8pA |
| Connectivity | SMB/BNC |
| Connectivity Type | Single |
| Connectivity Type | Coaxial |
| Characteristics Impedance | 50Ω |
| Residual Capacitance | <95fF |
| Probe Holder Material | Au-plated Bras |
| Probe Type | Variety of metal tips |
| Probe Tips Material | W, BeCu, Au-plated |
| Probe Tips Radius | 0.5μm-25μm |
| Minimum Pad Size | 25μm x 25μm |
| Temperature range | -60°C to 300°C |
| Temperature Stability | ±0.08°C |
| Temperature Accuracy | 0.1°C |
| Temperature Uniformity | <±0.5°C@200°C, <±1.0°C@300°C |
| Surface Flatness and Base Parallelism | <10μm@200°C, <15μm@300°C |
| Heating Rates | 20 to 200°C<15min, 200 to 300°C<30min |
| Cooling Rates | 200 to 20°C<20min, 300 to 20°C<30min |
| Electrical Isolation | >10TΩ@25°C, >300GΩ@200°C |
| Leakage@10V | <15fA@25°C, <30fA@200°C, <50fA@300°C |
| Capacitance | <900pF |
| Maximum Voltage Between Chuck Top and GND | 500VDC |
Applications
Key Features
Datasheet
Supplier Information
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