MPI TS50 50 mm Manual Probe System
The MPI TS50 is a 50 mm manual probe system designed for accurate and reliable DC/CV and RF measurements, ideal for research, development, and academic use in IC engineering.
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Overview
The MPI TS50 is a 50 mm manual probe system designed for accurate and reliable DC/CV and RF measurements, ideal for research, development, and academic use in IC engineering.
Specifications
| Parameter | Value |
|---|---|
| Total Travel Range | 100×75mm (3.9×3.0in) |
| Fine Travel Range | 25×25mm fine micrometer control |
| Fine Travel Resolution | <2.0μm (0.08mils) @500μm/rev |
| Planarity | <10μm |
| Theta Travel (Standard) | 360° |
| Theta Travel (Fine) | ±5.0° |
| Theta Resolution | 7.5×10^-3 gradient |
| Movement Control | Guided rail with instant lock mechanism |
| Material | Steel |
| Dimensions | 250mm (Inside), 408mm (Outside) |
| Chuck Top to Platen Top | Min. 28mm |
| Max. No of MicroPositioners | 6 DC and 2 RF |
| Platen Z-Height Movement | High resolution screw for fine control |
| Z-Height Adjustment Range | Max. 25mm (1in) |
| DC Positioner Mounting | Magnetic |
| RF Positioner Mounting | Magnetic with guide rail |
| Standard Wafer Chuck Diameter | 56mm |
| Standard Wafer Chuck Material | Stainless steel |
| Standard Wafer Chuck Surface | Planar with centric engraved vacuum grooves |
| Vacuum Grooves Sections (Diameter) | 4, 16, 30, 44mm |
| Vacuum Actuation | Multizone control - All connected in meander shape, center hole in 4mm diameter |
| Supported DUT Sizes | Single DUT 5×5mm size or wafers up to 50mm (2in) |
| Surface Planarity | ≤5μm |
| Rigidity | <15μm/10N @edge |
| RF Wafer Chuck Diameter | 50mm with 1 integrated AUX area |
| RF Wafer Chuck Material | Stainless steel with HF/OPTO surface (flat with 0.5mm holes) |
| RF Wafer Chuck Surface | Planar with 0.5mm diameter holes in centric sections |
| RF Vacuum Holes Sections (Diameter) | 4, 16, 30, 44mm |
| RF Vacuum Holes Actuation | Multizone control - vacuum hole on top, all connected at bottom in meander shape |
| RF Supported DUT Sizes | Single DUT 5×5mm size or wafers up to 50mm (2in) |
| RF Surface Planarity | ≤5μm |
| RF Rigidity | <15μm/10N @edge |
| Auxiliary Chuck Quantity | 1 AUX chuck |
| Auxiliary Chuck Position | Integrated to rear side of main chuck |
| Auxiliary Chuck Substrate Size (WxL) | Max. 25×25mm (1.0×1.0in) |
| Auxiliary Chuck Material | Ceramic |
| Auxiliary Chuck Material | RF absorbing material for accurate calibration |
| Auxiliary Chuck Surface Planarity | ≤5μm |
| Auxiliary Chuck Vacuum Control | Controlled independently |
| Auxiliary Chuck Vacuum Control | separate from chucks |
| Operation Voltage | Standard - in accordance with EC 61010, certificates for higher voltages available upon request |
| Maximum Voltage Between Chuck Top and GND | 500V DC |
| Isolation | >2GΩ |
| Power | 100-240V AC nominal; 50/60Hz for optical accessories only |
| Vacuum Pressure | ~0.5bar (for single DUT)/~0.3bar (for wafers) |
| Compressed Air Pressure | 0.2-0.7MPa (2.0-7.0bar) |
| Station Platform Dimensions (WxDxH) | 300×300×590mm (11.8×11.8×23.2in) |
| Station Platform Weight | ~30kg (66lb) |
Applications
1. Research and development in IC engineering 2. Academic use for single die probing 3. High frequency noise measurement 4. Load pull measurement
Key Features
1. Designed for research, development, and academic use 2. Solid and stable platform with small footprint 3. Supports up to 6 DC or 2 RF positioners 4. High resolution screw for precise adjustments 5. Multizone vacuum control for enhanced stability
Datasheet
Product Datasheet
PDF
Supplier Information
<p>Yingbo Scientific Instruments (Shanghai) Co., Ltd. is an enterprise focused on providing comprehensive solutions for semiconductor wafer-level testing systems, micro-nano science and other fields. It mainly provides advanced semiconductor testing systems and micro-nano scientific instruments and equipment to universities, scientific research institutes and enterprises and institutions, and is committed to bringing scientific research products with market prospects to the market.</p><p><br></p><p><br></p><p> At present, the company has become one of the few domestic companies that provides professional scientific instruments such as semiconductor wafer-level testing systems and micro-nano processing. In the fields of semiconductor wafer-level testing system solutions, micro-nano processing equipment, micro-nano characterization equipment, micro-nano field consumables, micro-nano processing and testing, micro-nano peripheral products and other related fields, the company has an experienced and highly skilled team that can excellently complete all-round services before, during and after sales. The company is headquartered in Shanghai, and has offices in Beijing and Shenzhen. It has established 8 after-sales service outlets in Wuhan, Xi'an, Chengdu, Hefei, Shenyang, Nanjing, Xiamen, Xuzhou and other places. The outlets across the country provide customers with a large number of high-quality equipment and after-sales services, and have won a good reputation and reputation in the semiconductor technology service industry.</p><p><br></p><p> The company adheres to the value concepts of innovation, integrity, professionalism and efficiency, and provides high-quality equipment and technical services to partners. In the future, the company will continue to recommend the introduction of innovative and efficient product instruments and contribute a small amount to the development of the motherland's semiconductor science industry!</p>
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