TruHeat MW Series
Homogeneous, precise, and reproducible microwave heating based on highly efficient GaN transistors.
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Rated Power | 8000W |
| Nominal Load Impedance | 50Ω |
| Output Frequency | 2.4GHz–2.5GHz |
| Line Voltage | 3/PE AC 400 bis 480V±10% |
| Line Frequency | 50/60Hz±3Hz |
| Line Input Power | 17.6kVA |
| Power Factor | >0.85 |
| Ethernet Interface | Yes |
| EtherCat Interface | Optional |
| PROFINET Interface | Optional |
| IP Protection Class | 20 |
| Dimensions (W×H×D) | 553mm×1168mm×1000mm |
| Maximum Water Pressure | 10bar |
| Minimum Pressure Difference | 3bar |
| Minimum Flow Rate | 24l/min |
| Coolant Temperature | 15°C–25°C |
| Overall Efficiency | typ. >50% (depending on frequency and CW/Pulse) |
| Certificates/Standards | ROHS, CE, EN61000-3-12,-3, EN61000-4-2,3,4,5,6,8,11, ENV50204, EN55024, EN55011 Group 2 Class A, EN61010-1 |
| Outside Temperature | 15°C–40°C |
| Humidity | 30%–80% (not condensing) |
Applications
Key Features
Datasheet
Supplier Information
Related Products
-
High-performance silicon wafers
Semiconductor Manufacturing Equipment
Ybsemi-Solution
Wafer Size: 150-200mm Resistivity Range: <0.001Ωcm to >10kΩcm Device Layer Thickness: 1μm to >200μm
Okmetic specializes in advanced silicon wafers tailored for MEMS, RF, and power devices, offering high resistivity and customizable solutions.
-
Wafer Scribing Machine
Semiconductor Manufacturing Equipment
Uwlaser
ParameterName: Parameter value Technical Specification - PositionAccuracy: ≤ 10μm (factory parallelism/flatness/verticality/right angle) XY AxisRepeatAccuracy: ±0.5μm
-
Wafer Cleaving System
Semiconductor Manufacturing Equipment
Uwlaser
ProcessingDimensions: 2 inch-6 inch wafer Technical Specification - Processing: About 2 dollars/s ProcessingAccuracy: ±3μm
-
Laser Wafer Modification Cutting System
Semiconductor Manufacturing Equipment
Uwlaser
Technical Specification - ProcessingWaferDimensions: 4inch, 6inch, 8inch, 12inch (optional) Technical Specification - Processing: Maximum 1000mm/s LoadingMethod: wafer Frame
-
Fully Automatic Optoelectronic Device Die Bonding and Assembly System
Semiconductor Manufacturing Equipment
Ybsemi-Solution
Equipment Type: Fully automatic die bonding and assembly system Configuration: Dual-station enclosed chamber with front double doors Observation Window: Large transparent safety windows on processing chamber
This is a fully automatic high-precision die bonding and assembly system designed for optoelectronic device manufacturing. Based on the product image, the equipment features a dual-station enclosed processing chamber with large observation windows, dual HMI touchscreen control panels, multi-color tower status lights, and automated cassette/magazine loading for substrates or wafers. The system integrates precision motion control, vision alignment, and automated material handling to achieve high-throughput, high-accuracy die attach, component placement, and packaging processes for photonic and semiconductor devices. The enclosed clean-room-compatible design with safety interlocks ensures process stability, particle control, and operator safety during continuous production.
Related Articles
Founded in Beijing in 2011, Beijing FJR Opto-electronic Technology Co., Ltd. specializes in R&D, manufacturing and sales of infrared thermal imaging equipment and complete optoelectronic systems.
Founded in 2004, Wuhan Union Optic Inc. is a National Specialized, Refined, Unique & Innovative "Little Giant" high-tech enterprise located in Wuhan East Lake High-Tech Development Zone.
Looking for a market-verified 808nm pump laser diode? This guide introduces HAUCORE DM-8E5A-8OD (HGLD-808-COS-D-5W), its core advantages, key specs and mainstream industrial, medical & research applications.
VCSEL, short for Vertical Cavity Surface Emitting Laser, is a widely used semiconductor laser component in modern optoelectronics. Unlike traditional edge-emitting lasers, VCSEL emits laser light vertically from its chip surface. Thanks to its low power consumption, stable beam quality, low cost, and easy integration, it has become the core light source for 3D sensing, wearable devices, and high-speed optical communication.
Loading...
Name
Phone
Organization
Use Case
Database Platform