A19 FC

A19 FC

Supplier
EngWx
Part Number
A19 FC
Category
Semiconductor Packaging Equipment
Origin
China

A19 FC is a chip flip-chip bonding equipment designed for high-precision and efficient chip assembly.

Specification Snapshot
Equipment Dimensions
2000mm x 1500mm x 1800mm
Chip Size Range
0.5mm x 0.5mm to 10mm x 10mm
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Overview

A19 FC is a chip flip-chip bonding equipment designed for high-precision and efficient chip assembly.

Specifications

ParameterValue
Equipment Dimensions2000mm x 1500mm x 1800mm
Weight1200kg
Chip Size Range0.5mm x 0.5mm to 10mm x 10mm
Bonding Accuracy±3μm
Bonding SpeedUp to 5000 UPH
Operating Temperature Range15°C to 30°C
Power RequirementsAC220V, 50Hz, 3kW

Applications

1. Semiconductor manufacturing 2. Optical communication 3. Microelectronics assembly

Key Features

1. High precision bonding 2. Wide chip size compatibility 3. User-friendly interface 4. Stable and reliable performance

Datasheet

Product Datasheet
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Supplier Information

<p>Founded in 2016, the team includes excellent management and R&D personnel from Tsinghua University, Xi'an Jiaotong University, Harbin Institute of Technology and other well-known universities in the semiconductor equipment industry, focusing on the R&D and manufacturing of advanced packaging equipment for power modules, optical communications, sensors, microwaves, LiDAR, etc. Products have entered leading companies such as BYD Semiconductor, Zhongji Innolight, China Resources Microelectronics, ON Semiconductor.</p>

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A19 FC
EngWx · Semiconductor Packaging Equipment
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