A19 FC
A19 FC is a chip flip-chip bonding equipment designed for high-precision and efficient chip assembly.
Specification Snapshot
Equipment Dimensions
2000mm x 1500mm x 1800mm
Chip Size Range
0.5mm x 0.5mm to 10mm x 10mm
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Overview
A19 FC is a chip flip-chip bonding equipment designed for high-precision and efficient chip assembly.
Specifications
| Parameter | Value |
|---|---|
| Equipment Dimensions | 2000mm x 1500mm x 1800mm |
| Weight | 1200kg |
| Chip Size Range | 0.5mm x 0.5mm to 10mm x 10mm |
| Bonding Accuracy | ±3μm |
| Bonding Speed | Up to 5000 UPH |
| Operating Temperature Range | 15°C to 30°C |
| Power Requirements | AC220V, 50Hz, 3kW |
Applications
1. Semiconductor manufacturing 2. Optical communication 3. Microelectronics assembly
Key Features
1. High precision bonding 2. Wide chip size compatibility 3. User-friendly interface 4. Stable and reliable performance
Datasheet
Product Datasheet
PDF
Supplier Information
<p>Founded in 2016, the team includes excellent management and R&D personnel from Tsinghua University, Xi'an Jiaotong University, Harbin Institute of Technology and other well-known universities in the semiconductor equipment industry, focusing on the R&D and manufacturing of advanced packaging equipment for power modules, optical communications, sensors, microwaves, LiDAR, etc. Products have entered leading companies such as BYD Semiconductor, Zhongji Innolight, China Resources Microelectronics, ON Semiconductor.</p>
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