G19

G19

Supplier
Eng-wx
Part Number
G19
Category
Semiconductor Packaging Equipment
Origin
China

G19 is a high-precision intelligent mounting equipment designed for advanced optical applications. It offers exceptional accuracy and efficiency in automated assembly processes.

Specification Snapshot
Device Dimensions
1200mm x 800mm x 1800mm
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Overview

G19 is a high-precision intelligent mounting equipment designed for advanced optical applications. It offers exceptional accuracy and efficiency in automated assembly processes.

Specifications

ParameterValue
Power2kW
Mounting Accuracy±0.01mm
Maximum Mounting Speed5000 units/hour

Applications

1. Optical component assembly 2. Precision manufacturing 3. Automation in optical systems

Key Features

1. High precision mounting 2. Intelligent control system 3. User-friendly interface 4. High-speed operation

Datasheet

Product Datasheet
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Supplier Information

En
Eng-wx
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Founded in 2016, Energy has its core team members from top universities such as Nanyang Technological University in Singapore, Tsinghua University, and Harbin Institute of Technology. The company is deeply engaged in advanced packaging fields including optical modules, power modules, memories, and sensors, and has established long-term strategic cooperation with industry leaders such as InnoLight, Finisar, Fabrinet, BYD, Onsemi, and Schaeffler.

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G19
Eng-wx · Semiconductor Packaging Equipment
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