WB20 Ultrasonic Wire Bonding Machine

WB20 Ultrasonic Wire Bonding Machine

Supplier
Eng-wx
Part Number
WB20 Ultrasonic Wire Bonding Machine
Category
Semiconductor Packaging Equipment
Origin
China

The WB20 ultrasonic wire bonding machine is designed for precision wire bonding applications, offering high reliability and advanced technology.

Specification Snapshot
Operating Frequency
60kHz
Worktable Dimensions
300mm x 300mm
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Overview

The WB20 ultrasonic wire bonding machine is designed for precision wire bonding applications, offering high reliability and advanced technology.

Specifications

ParameterValue
Operating Frequency60kHz
Bonding Wire Diameter Range15-75μm
Bonding Speed5000 bonds/hour
Microscope Magnification10x-100x

Applications

1. Semiconductor packaging 2. Microelectronics assembly 3. Optoelectronic device manufacturing

Key Features

1. High precision bonding 2. User-friendly interface 3. Real-time monitoring 4. Wide compatibility with wire diameters

Datasheet

Product Datasheet
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Supplier Information

En
Eng-wx
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Founded in 2016, Energy has its core team members from top universities such as Nanyang Technological University in Singapore, Tsinghua University, and Harbin Institute of Technology. The company is deeply engaged in advanced packaging fields including optical modules, power modules, memories, and sensors, and has established long-term strategic cooperation with industry leaders such as InnoLight, Finisar, Fabrinet, BYD, Onsemi, and Schaeffler.

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WB20 Ultrasonic Wire Bonding Machine
Eng-wx · Semiconductor Packaging Equipment
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