WB20 Ultrasonic Wire Bonding Machine
The WB20 ultrasonic wire bonding machine is designed for precision wire bonding applications, offering high reliability and advanced technology.
Specification Snapshot
Operating Frequency
60kHz
Worktable Dimensions
300mm x 300mm
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Overview
The WB20 ultrasonic wire bonding machine is designed for precision wire bonding applications, offering high reliability and advanced technology.
Specifications
| Parameter | Value |
|---|---|
| Operating Frequency | 60kHz |
| Bonding Wire Diameter Range | 15-75μm |
| Bonding Speed | 5000 bonds/hour |
| Microscope Magnification | 10x-100x |
Applications
1. Semiconductor packaging 2. Microelectronics assembly 3. Optoelectronic device manufacturing
Key Features
1. High precision bonding 2. User-friendly interface 3. Real-time monitoring 4. Wide compatibility with wire diameters
Datasheet
Product Datasheet
PDF
Supplier Information
Founded in 2016, Energy has its core team members from top universities such as Nanyang Technological University in Singapore, Tsinghua University, and Harbin Institute of Technology. The company is deeply engaged in advanced packaging fields including optical modules, power modules, memories, and sensors, and has established long-term strategic cooperation with industry leaders such as InnoLight, Finisar, Fabrinet, BYD, Onsemi, and Schaeffler.
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