Domestic BF33
Borosilicate Glass Mainly SiO2/B2O3,Float-Formed with High Native Flatness on Both Sides,General Microelectronic/Optical Specialty Glass.
Specification Snapshot
Quartz-Glass Wafer Substrate - Diameter
25.4mm
Quartz-Glass Wafer Substrate - Diameter
50.8 mm
Quartz-Glass Wafer Substrate - Diameter
100mm
Quartz-Glass Wafer Substrate - Diameter
150mm
Quartz-Glass Wafer Substrate - Diameter
200mm
Quartz-Glass Wafer Substrate - Diameter
300mm
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Overview
Borosilicate Glass Mainly SiO2/B2O3,Float-Formed with High Native Flatness on Both Sides,General Microelectronic/Optical Specialty Glass.
Specifications
| Parameter | Value |
|---|---|
| Quartz-Glass Wafer Substrate - Domestic Grade | Fused Silica: Domestic JGS1, JGS2, JGS3; Borosilicate Glass: Domestic BF33; YOFC Silica YS-1330 and Others |
| Quartz-Glass Wafer Substrate - Imported Grade | Germany Schott BF33, USA Corning 7980, Japan Ohara SK-1300 and Others |
| Quartz-Glass Wafer Substrate - Diameter | 25.4mm |
| Quartz-Glass Wafer Substrate - Diameter | 50.8 mm |
| Quartz-Glass Wafer Substrate - Diameter | 100mm |
| Quartz-Glass Wafer Substrate - Diameter | 150mm |
| Quartz-Glass Wafer Substrate - Diameter | 200mm |
| Quartz-Glass Wafer Substrate - Diameter | 300mm |
| Quartz-Glass Wafer Substrate - Thickness (Ultrathin Thickness) [Diameter: 25.4mm] | 150μm; 500μm |
| Quartz-Glass Wafer Substrate - Thickness (Ultrathin Thickness) [Diameter: 50.8 mm] | 150μm; 500μm |
| Quartz-Glass Wafer Substrate - Thickness (Ultrathin Thickness) [Diameter: 100mm] | 100μm; 500μm |
| Quartz-Glass Wafer Substrate - Thickness (Ultrathin Thickness) [Diameter: 150mm] | 200μm; 500μm; 725μm; 1000μm |
| Quartz-Glass Wafer Substrate - Thickness (Ultrathin Thickness) [Diameter: 200mm] | 200μm; 725μm; 1000μm |
| Quartz-Glass Wafer Substrate - Thickness (Ultrathin Thickness) [Diameter: 300mm] | 300μm; 725μm; 1000μm |
| Quartz-Glass Wafer Substrate - Surface Roughness | Double Sides Polished, Ra< 1.0nm |
| Quartz-Glass Wafer Substrate - Orientation - Flat [Diameter: 25.4mm] | 8mm |
| Quartz-Glass Wafer Substrate - Orientation - Flat [Diameter: 50.8 mm] | 16mm |
| Quartz-Glass Wafer Substrate - Orientation - Flat [Diameter: 100mm] | 30mm |
| Quartz-Glass Wafer Substrate - Orientation - Flat [Diameter: 150mm] | 47.5mm |
| Quartz-Glass Wafer Substrate - Orientation - Notch [Diameter: 150mm] | Semi-Notch |
| Quartz-Glass Wafer Substrate - Orientation - Notch [Diameter: 200mm] | Semi-Notch |
| Quartz-Glass Wafer Substrate - Orientation - Notch [Diameter: 300mm] | Semi-Notch |
| Quartz-Glass Wafer Substrate - Surface Finish | S/D 60/40, S/D 40/20 |
| Quartz-Glass Wafer Substrate - Edge Exclusion | ≤ 2mm |
| Quartz-Glass Wafer Substrate - Surface Figure [Diameter: 25.4mm] | TTV< 2μm |
| Quartz-Glass Wafer Substrate - Surface Figure [Diameter: 50.8 mm] | TTV< 2μm |
| Quartz-Glass Wafer Substrate - Surface Figure [Diameter: 100mm] | TTV< 2μm |
| Quartz-Glass Wafer Substrate - Surface Figure [Diameter: 150mm] | TTV< 2μm |
| Quartz-Glass Wafer Substrate - Surface Figure [Diameter: 200mm] | TTV< 2μm |
| Quartz-Glass Wafer Substrate - Surface Figure [Diameter: 300mm] | TTV< 2μm |
| Mechanical Properties - Density ρ (at 25°C) | 2.23 g/cm³ |
| Mechanical Properties - Young's Modulus E (According to DIN 13316) | 64kN/mm² |
| Mechanical Properties - Poisson's Ratio μ (According to DIN 13316) | 0.2 |
| Mechanical Properties - Knoop Hardness HK₁/20 (According to DIN ISO 9385) | 480 |
| Chemical Properties - Water Resistance | (According to ISO 719/DIN 12 111) HGB 1 |
| Chemical Properties - Water Resistance | (According to ISO 720) HGA 1 |
| Chemical Properties - Acid Resistance | (According to DIN 12 116) 1 |
| Chemical Properties - Acid Resistance | (According to ISO 1776) ≤100 μgNa2O per 100cm2 |
| Chemical Properties - Alkali Resistance | (According to ISO 695/DIN 52 322) A 2 |
| Thermal Properties - Specific Heat Capacity cp (20-100℃) | 0.83 kJ/(kg.K) |
| Thermal Properties - Thermal Conductivity λ (90℃) | 1.2 W/(m ·K) |
| Thermal Properties - Phase Transition Temperature Tg* (According to ISO 7884) | 525℃ |
Applications
MEMS Sensors; Microfluidic Chips; Biological Detection Slides; Laboratory Optical Windows and Others
Key Features
Key Benefits:Lightweight,Strong Abrasion/Scratch Resistance,High Elasticity;High Water Resistance,Excellent Acid Resistance,Exceptional Alkali Resistance,Extremely Low Alkali-Metal Ion Diffusion;Excellent Temperature Stability/Thermal-Shock Resistance,Thermally Temperable and3D Thermoformable
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Supplier Information
Jiangyin Jingmu Optoelectronic New Materials Co., Ltd. is a technology-oriented enterprise dedicated to semiconductor wafer material processing and epitaxial technology. With a decade of focus on semiconductor substrates, including SiC, sapphire, silicon, and third/fourth-generation materials like diamond, GaN, Ga2O3, AlN, it also provides optical wafers and carrier products. Equipped with advanced processing technologies such as cutting, grinding, polishing, laser processing, epitaxial coating, and wafer bonding, it collaborates with universities for R&D, offering customized solutions. Products are widely used in LED, power devices, RF, and optical communication.
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