Standard Gallium Antimonide
GaSb Substrate:Low Bandgap,High Electron Mobility/Thermal Stability,Core Material for Type II Superlattice IR Focal-Plane Chips.
Specification Snapshot
Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Diameter
50.8mm
Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Diameter
76.2mm
Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Diameter
100mm
Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Thickness [Diameter: 50.8mm]
500μm
Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Thickness [Diameter: 76.2mm]
600μm
Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Thickness [Diameter: 100mm]
800μm
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Overview
GaSb Substrate:Low Bandgap,High Electron Mobility/Thermal Stability,Core Material for Type II Superlattice IR Focal-Plane Chips.
Specifications
| Parameter | Value |
|---|---|
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Diameter | 50.8mm |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Diameter | 76.2mm |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Diameter | 100mm |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Thickness [Diameter: 50.8mm] | 500μm |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Thickness [Diameter: 76.2mm] | 600μm |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Thickness [Diameter: 100mm] | 800μm |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Surface Crystal Orientation | (100)/(111)/(110)±0.1° |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Orientation-Flat Length [Diameter: 50.8mm] | 8±1mm |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Orientation-Flat Length [Diameter: 76.2mm] | 11±1mm |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Orientation-Flat Length [Diameter: 100mm] | 18±1mm |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Total Thickness Variation TTV | <10μm |
| Gallium Antimonide GaSb Single-Crystal Substrate (2~4 Inches) - Bow | <10μm |
| Conductivity Type [Dopant Element: N/A; Carrier Concentration: <1*E17/cm³] | P-Type |
| Dislocation Density (EPD)/c [Dopant Element: N/A; Carrier Concentration: <1*E17/cm³] | 2inch <50 |
| Carrier Concentration [Dopant Element: N/A; Carrier Concentration: <1*E17/cm³] | <1*E17/cm³ |
| Electron Mobility [Dopant Element: N/A; Carrier Concentration: <1*E17/cm³] | 200~700cm²/v.s |
| Dopant Element [Dopant Element: Zn Doping; Carrier Concentration: >1*E18/cm³] | Zn-doping |
| Conductivity Type [Dopant Element: Zn Doping; Carrier Concentration: >1*E18/cm³] | P-Type |
| Dislocation Density (EPD)/c [Dopant Element: Zn Doping; Carrier Concentration: >1*E18/cm³] | 2inch<1000 |
| Carrier Concentration [Dopant Element: Zn Doping; Carrier Concentration: >1*E18/cm³] | >1*E18/cm³ |
| Electron Mobility [Dopant Element: Zn Doping; Carrier Concentration: >1*E18/cm³] | 200~500cm²/v.s |
| Dopant Element [Dopant Element: Te Doping; Carrier Concentration: 1*E15-2*E17/cm³] | Te-doping |
| Conductivity Type [Dopant Element: Te Doping; Carrier Concentration: 1*E15-2*E17/cm³] | N Type |
| Dislocation Density (EPD)/c [Dopant Element: Te Doping; Carrier Concentration: 1*E15-2*E17/cm³] | 2inch<200; 3inch<500; 4inch<1000 |
| Carrier Concentration [Dopant Element: Te Doping; Carrier Concentration: 1*E15-2*E17/cm³] | 1*E15-2*E17/cm³ |
| Electron Mobility [Dopant Element: Te Doping; Carrier Concentration: 1*E15-2*E17/cm³] | 2000-3500cm²/v.s |
| Dopant Element [Dopant Element: Te Doping; Carrier Concentration: (2-20)*E17/cm³] | Te-doping |
| Conductivity Type [Dopant Element: Te Doping; Carrier Concentration: (2-20)*E17/cm³] | N Type |
| Dislocation Density (EPD)/c [Dopant Element: Te Doping; Carrier Concentration: (2-20)*E17/cm³] | 2inch <50 |
| Carrier Concentration [Dopant Element: Te Doping; Carrier Concentration: (2-20)*E17/cm³] | (2-20)*E17/cm³ |
| Electron Mobility [Dopant Element: Te Doping; Carrier Concentration: (2-20)*E17/cm³] | 2000-3500cm²/v.s |
Applications
IR Detection,High-Speed Communication,Efficient Photovoltaics/High-Frequency Devices;Night Vision,Communication,Meteorology/Atmosphere,Industrial Flaws,Earth Resources,Temperature
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Supplier Information
Jiangyin Jingmu Optoelectronic New Materials Co., Ltd. is a technology-oriented enterprise dedicated to semiconductor wafer material processing and epitaxial technology. With a decade of focus on semiconductor substrates, including SiC, sapphire, silicon, and third/fourth-generation materials like diamond, GaN, Ga2O3, AlN, it also provides optical wafers and carrier products. Equipped with advanced processing technologies such as cutting, grinding, polishing, laser processing, epitaxial coating, and wafer bonding, it collaborates with universities for R&D, offering customized solutions. Products are widely used in LED, power devices, RF, and optical communication.
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