Sapphire Wafer
Sapphire, a single crystal of aluminum oxide, is the second hardest material in nature after diamond. It exhibits desirable transparency, high strength, impact resistance, abrasion resistance, corrosion resistance, high temperature, high-pressure resistance, and biocompatibility. Therefore, sapphire is an ideal substrate material for manufacturing semiconductor optoelectronic devices and white and blue LEDs. Our company specializes in the production of high-precision sapphire wafers with a thickness of ≥0.1mm and outer dimensions of ≥Φ2". In addition to the conventional Φ2-inch, Φ4-inch, Φ6-inch, and Φ8-inch sizes, we also offer customized services for other sizes. Please contact our sales for more information. Due to its ability to effectively block the flow of current, sapphire wafers are ideal for use in applications requiring electrical isolation between electronic devices and components. Its hard and scratch-resistant properties make sapphire wafers highly durable and resistant to mechanical damage, making them advantageous for applications requiring substrates to withstand harsh handling or environmental conditions.
Overview
Specifications
| Parameter | Value |
|---|---|
| Diameter [4 inch;± 0.1 mm] | 100 ± 0.1 mm |
| Diameter [5 inch;± 0.1 mm] | 125 ± 0.1 mm |
| Diameter [6 inch;± 0.1 mm] | 150 ± 0.1 mm |
| Diameter [8 inch;± 0.1 mm] | 200 ± 0.1 mm |
| Diameter [12 inch;± 0.1 mm] | 300± 0.1 mm |
| Thickness [4 inch;± 5 um;or customized] | 500 ± 5 um or customized |
| Thickness [5 inch;± 5 um;or customized] | 625 ± 5 um or customized |
| Thickness [6 inch;± 5 um;or customized] | 675 ± 5 um or customized |
| Thickness [8 inch;± 5 um;or customized] | 725 ± 5 um or customized |
| Thickness [12 inch;± 5 um;or customized] | 900± 5 um or customized |
| Roughness Ra [4 inch] | Ra ≤ 1 nm |
| Roughness Ra [5 inch] | Ra ≤ 1 nm |
| Roughness Ra [6 inch] | Ra ≤ 1 nm |
| Roughness Ra [8 inch] | Ra ≤ 1 nm |
| Roughness Ra [12 inch] | Ra ≤ 1 nm |
| Warpage [4 inch] | ≤ 10um |
| Warpage [5 inch] | ≤ 10um |
| Warpage [6 inch] | ≤ 10um |
| Warpage [8 inch] | ≤ 10um |
| Warpage [12 inch] | ≤ 10um |
| Flatness [4 inch] | ≤ 3 um |
| Flatness [5 inch] | ≤ 3 um |
| Flatness [6 inch] | ≤ 3 um |
| Flatness [8 inch] | ≤ 3 um |
| Flatness [12 inch] | ≤ 3 um |
| Surface [4 inch] | 20/10 |
| Surface [5 inch] | 20/10 |
| Surface [6 inch] | 20/10 |
| Surface [8 inch] | 20/10 |
| Surface [12 inch] | 20/10 |
| Shape [4 inch] | Round, with locating edges, with locating angles |
| Shape [5 inch] | Round, with locating edges, with locating angles |
| Shape [6 inch] | Round, with locating edges, with locating angles |
| Shape [8 inch] | Round, with locating edges, with locating angles |
| Shape [12 inch] | Round, with locating edges, with locating angles |
| Inverted edges [4 inch] | 45°, SEMI Spec; C Shape |
| Inverted edges [5 inch] | 45°, SEMI Spec; C Shape |
| Inverted edges [6 inch] | 45°, SEMI Spec; C Shape |
| Inverted edges [8 inch] | 45°, SEMI Spec; C Shape |
| Inverted edges [12 inch] | 45°, SEMI Spec; C Shape |
| Material [4 inch] | Corning, Nikon, Heraeus etc. |
| Material [5 inch] | Corning, Nikon, Heraeus etc. |
| Material [6 inch] | Corning, Nikon, Heraeus etc. |
| Material [8 inch] | Corning, Nikon, Heraeus etc. |
| Material [12 inch] | Corning, Nikon, Heraeus etc. |
Datasheet
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