Ultrathin Flexible Diamond
Ultrathin diamond films, thickness 0.1-10 μm, retain diamond's extreme hardness, high thermal conductivity, broadband transmission, and excellent chemical inertness while offering subnanometer surface smoothness and 360-degree flexibility, overcoming conventional diamond's brittleness and inability to bend. The company's core process consistently produces 2-4 inch ultrathin flexible films. Precision polishing of 10 μm films controls roughness below 5 nm. Typical characterization: before-and-after growth images show a dense diamond film on a Si substrate; Raman spectra demonstrate good crystal quality and uniformity across the film; optical microscope images; surface SEM images; cross-sectional SEM shows a film thickness of approximately 2 µm; trial release; small-piece release and flexibility testing; full two-inch wafer release and Raman characterization.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Process | Plasma-Assisted Chemical Vapor Deposition (MPCVD) |
| Dimensions | 2 Inches/3 Inches |
| Thickness | 0.5-2 μm |
| Substrate | Si |
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