Silicon Carbide Polishing Slurry DPP-SiC

Silicon Carbide Polishing Slurry DPP-SiC

Supplier
Union-diamond
Part Number
DPP-SiC
Category
Optical Material
Origin
China
Request a Quote Download Datasheet
Save to Favorites Save to Favorites

Specifications

ParameterValue
Particle Size Specifications D50D50=2-4μm
Particle Size Specifications D50D50=0-1μm
Particle Size Specifications D50D50=0.2μm
Abrasive Type [D50=2-4μm]Polycrystalline/Polycrystalline-Like
Properties [D50=2-4μm]Stable Suspension, Water-Soluble Carrier
Abrasive Type [D50=0-1μm]Polycrystalline/Polycrystalline-Like
Properties [D50=0-1μm]Stable Suspension, Water-Soluble Carrier
Abrasive Type [D50=0.2μm]Polycrystalline-Like
Properties [D50=0.2μm]Stable Suspension, Water-Soluble Carrier

Applications

This product is mainly used for coarse grinding and thinning of silicon carbide wafers, and for fine grinding and polishing of silicon carbide wafers and similar materials.

Key Features

(1) Used with a cast-iron disc, the product provides high material removal rates while maintaining silicon carbide wafer quality, including Warp, warpage, and TTV. (2) Good rust prevention. (3) Stable suspension of diamond abrasive, with no obvious settling after prolonged storage. (4) Strict quality control ensures consistent, stable product quality. (1) Used with a dedicated silicon carbide fine-grinding pad, the product achieves high removal rates and improves efficiency. (2) High surface quality after fine grinding, including roughness, scratches, and subsurface damage. (3) A water-soluble carrier formulation provides good cleanability. (4) Good suspension stability. (5) Better lubricity than conventional water-based formulations.

Datasheet

Please provide your email to download the datasheet.

Your name
Email Address

Invalid email format. Please try again.

Send Request

Supplier Information

Un
Union-diamond
View Supplier →
Henan Union Precision Material Co., Ltd. was established on June 26, 2002. It is a high-tech enterprise dedicated to the research, development, production and sales of precision grinding and polishing materials and their high-end products. The company currently has a series of products including fine abrasives and fluid abrasives, and is also committed to providing overall grinding and polishing solutions for industries such as semiconductors and integrated circuits. It mainly serves precision processing fields such as semiconductor wafer processing, diamond wire for photovoltaic silicon wafer cutting, consumer electronics grinding and polishing, and sapphire LED substrate grinding, and continuously innovates and achieves breakthroughs in these fields. Henan Union Precision Material Co., Ltd. attaches importance to standardized management, has passed ISO9001, ISO14001 and ISO45001 system certifications, and strictly implements system specifications. Union Precision has developed into a supplier and service provider of ultra-precision grinding and polishing materials with core competitiveness in the superhard material industry, and has won customers' trust and recognition based on a solid R&D foundation, stable quality and high-quality service.

Request a Quote

Our team responds within 24–48 hours
Silicon Carbide Polishing Slurry DPP-SiC
Union-diamond · Optical Material
Direct from Manufacturer
Your inquiry will be sent directly to the manufacturer
Photonics Source Platform
We handles the inquiry on your behalf
Your information is protected and will never be shared without consent.
Contact Us

Loading...

GetExperimental Plan

Name

Phone

+86

Organization

Use Case

AI Parametric Selection
Smart Match · Precise Recs
Enter Specifications
AI Smart Matching
Get Best Matches
Skip Manual Comparison
Find Best Solutions Fast
Select Now →