Ultraviolet Femtosecond Laser Ablator-FUV-20
The new-generation Ablator-FUV industrial UV femtosecond laser uses the latest all-PM-fiber NALM mode-locked linear-cavity femtosecond fiber seed source with solid-state amplification. Harmonic conversion produces output at 343nm, with maximum power >20W, maximum single-pulse energy 30uJ and pulse width 400-800fs. The upgraded control system provides more stable operation and supports Burstmode, external triggering and POD/PSD. Applications include material micro/nanomachining, display-material cutting, brittle-material cutting, MEMS manufacturing and integrated photonics.
Specification Snapshot
Center wavelength
343 nm
Repetition rate
800-3000 kHz
Operating temperature
20-30 °C
Weight
75 kg
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Overview
The new-generation Ablator-FUV industrial UV femtosecond laser uses the latest all-PM-fiber NALM mode-locked linear-cavity femtosecond fiber seed source with solid-state amplification. Harmonic conversion produces output at 343nm, with maximum power >20W, maximum single-pulse energy 30uJ and pulse width 400-800fs. The upgraded control system provides more stable operation and supports Burstmode, external triggering and POD/PSD. Applications include material micro/nanomachining, display-material cutting, brittle-material cutting, MEMS manufacturing and integrated photonics.
Specifications
| Parameter | Value |
|---|---|
| Operating mode | Pulsed (Pulse) |
| Center wavelength | 343 nm |
| Max Output Power | >20 W |
| PSO/POD Function | Supported |
| Pulse width | 400-800 fs |
| Pulse Count [Burst Mode] | 1-10 |
| Repetition rate | 800-3000 kHz |
| Polarization method | Linear polarization (Linear) |
| Max Single-pulse energy | 30 uJ |
| Beam quality M2 | ≤1.3 |
| Extinction ratio | >20 dB |
| Power stability [RMS@8h] | <1 % |
| Pulse Stability [RMS] | <1 % |
| Output Spot diameter | 2.0±0.3 mm |
| Adjustable Optical Output Power Range | 0-100 % |
| Cooling method | Water cooling |
| Power consumption | 1000 W |
| Operating voltage | 220 VAC |
| Operating temperature | 20-30 °C |
| Storage temperature | 0-60 °C |
| Volume [L*W*H] | 738 mm × 506 mm × 195 mm |
| Weight | 75 kg |
Applications
Material Micro- and Nanoprocessing ;OLED Module Cutting ; Sapphire , Ceramic Cover-Plate Cutting ; Composite Thin-Film Processing ; Semiconductor Wafer Processing ; Lithium-Battery Separator Cutting ; Glass and Metal Welding
Key Features
Compact all-in-one design; all-PM NALM mode-locked seed source with a straight cavity; hybrid fiber/solid-state technology and excellent beam quality; outstanding suitability and lifetime in industrial environments; flexible customization
Datasheet
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Supplier Information
Founded in 2020, Guangdong PulseX Laser Technology Co., Ltd. is headquartered in Huangpu District, Guangzhou, with its R&D center and manufacturing base located in Shunde District, Foshan. As a national high-tech enterprise, the company adheres to independent R&D and technological innovation, building a team of master's and doctoral researchers in optics, electronics, mechanics, and software, focusing on solid-state lasers and core components. Equipped with a world-class solid-state laser R&D center and Class 100 cleanroom, along with advanced production and testing instruments, its lasers are widely used in precision machining, precision measurement, scientific research, aerospace, and consumer electronics, exported to Europe, America, Southeast Asia, Japan, and other regions. Upholding the philosophy of 'Innovation, Focus, Win-win', PulseX is dedicated to becoming a world-class pulsed laser manufacturer, creating value for customers and promoting high-quality development of China's solid-state laser industry.
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