MMEPU-355-10-HE-D30
Low processing heat resulting in less damage to the cut surface so reaches a smoother surface; all-in-one laser design, easy to install and maintain; superior beam quality can achieve deeper and faster processing, more advantageous in cutting SiC, diamond and other super hard materials; self-cleaning system of resonant cavity solves the problem of power attenuation to maintain a long service life.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Optical Characteristics-Wavelength | 355nm |
| Optical Characteristics-Average Power [@10kHz] | >10W@10kHz |
| Optical Characteristics-Single Pulse Energy [@10kHz] | ~1000uj@10kHz |
| Optical Characteristics-Pulse Width [@10kHz] | <30ns@10kHz |
| Optical Characteristics-Frequency Range | 10-100kHz |
| Optical Characteristics-Pulse Stability | <3% rms |
| Optical Characteristics-Long Term Stability | <±3% |
| Beam Characteristics-Polarization Ratio | Horizontal;>100:1 |
| Beam Characteristics-Beam Diameter | ~0.9mm(at exit) |
| Beam Characteristics-Beam Circularity | >90% |
| Beam Characteristics-Spatial Mode | TEM00, M² < 1.3 |
| Operating Specifications-Warm-up Time | <15 minutes from cold start |
| Operating Specifications-Electrical Requirement | DC17.5V，350W |
| Operating Specifications-Ambient Temperature | 10-35℃，RH<80% |
| Operating Specifications-Storage Conditions | -10-40℃，RH<90% |
| Physical Characteristics-Cooling System | Water-Cooled |
| Physical Characteristics-Water Temperature (laser inlet) | 25℃ |
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