MMEPA-1064-18/25-HE-D70 MMEPA-1064-18-HE-D70
Higher peak power of the laser enables greater processing capability and efficiency, particularly in cutting ultra-hard materials like silicon carbide and diamond. The laser system is highly integrated, incorporating the laser, power supply, Q-switching control, and protection circuits into a compact and easy-to-install unit, facilitating maintenance. The internal resonator cavity is equipped with a self-cleaning system and stable cavity design, addressing power attenuation issues and ensuring an extended lifespan.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Optical Characteristics-Wavelength | 1064nm |
| Optical Characteristics-Average Power [@10kHz] | >18W@10kHz |
| Optical Characteristics-Single Pulse Energy [@10kHz] | ~1800uJ@10kHz |
| Optical Characteristics-Pulse Width [@10kHz] | >70ns@10kHz |
| Optical Characteristics-Frequency Range | 7-100kHz |
| Optical Characteristics-Pulse Stability | <3% rms |
| Optical Characteristics-Long Term Stability | <±3% |
| Beam Characteristics-Polarization Ratio | Random |
| Beam Characteristics-Beam Diameter | ~0.9mm(at exit) |
| Beam Characteristics-Beam Circularity | >90% |
| Beam Characteristics-Spatial Mode | TEM00, M² < 1.5 |
| Operating Specifications-Warm-up Time | <15 minutes from cold start |
| Operating Specifications-Electrical Requirement | DC24V，500W |
| Operating Specifications-Ambient Temperature | 10-35℃，RH<80% |
| Operating Specifications-Storage Conditions | -10-40℃，RH<90% |
| Physical Characteristics-Cooling System | Water-Cooled |
| Physical Characteristics-Water Temperature (laser inlet) | 25℃ |
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