Custom Nonstandard Laser J-1342W-100K-5
This laser outputs at 1342nm, a wavelength with high transmission through silicon wafers, allowing light to reach the intended internal cutting position with minimal obstruction. It is mainly used for wafer stealth dicing. High, adjustable repetition rate, high single-pulse energy, high beam quality and high stability meet industrial requirements for uninterrupted, stable 7x24-hour production.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Wavelength | 1342nm |
| Pulse width [20kHz；@20kHz] | <25ns@20kHz |
| Repetition rate | 20kHz~200kHz |
| Beam quality M² | M²<1.2 |
| Average Power | >5W |
| Pulse energy [20kHz；@20kHz] | >250uJ@20kHz |
| Power stability | ≤1% |
| Power supply | AC 220V 12A |
| Power supply Control | RS232 |
| Storage temperature | +10°C~+40°C |
| Ambient Temperature | +15°C~+35°C |
| Ambient Humidity | <85%RH |
| Cooling method | Water cooling |
| Laser head Dimensions | 511×206×136(mm) |
| Power supply Dimensions | 550×483×88(mm) |
Key Features
Datasheet
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Supplier Information
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