Stainless Steel Wafer Dicing Frame (Wafer Ring / Film Frame)

Stainless Steel Wafer Dicing Frame (Wafer Ring / Film Frame)

Supplier
Zzqsjm
Part Number
Stainless Steel Wafer Dicing Frame (Wafer Ring / Film Frame)
Category
Semiconductor Packaging Equipment
Origin
China

This product is a stainless steel wafer dicing frame, also known as a wafer ring or film frame, designed for semiconductor and optoelectronic wafer-level processing. The frame features a precision-machined circular inner opening and an octagonal outer profile, and is used together with UV dicing tape or back-grinding tape to hold wafers securely during dicing, grinding, mounting, and transportation. Its polished metallic surface and rigid structure ensure stable wafer support, reliable tape adhesion, and full compatibility with mainstream dicing saws, wafer grinders, and tape mounting machines used in IC, LED, and MEMS manufacturing.

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Overview

This product is a stainless steel wafer dicing frame, also known as a wafer ring or film frame, designed for semiconductor and optoelectronic wafer-level processing. The frame features a precision-machined circular inner opening and an octagonal outer profile, and is used together with UV dicing tape or back-grinding tape to hold wafers securely during dicing, grinding, mounting, and transportation. Its polished metallic surface and rigid structure ensure stable wafer support, reliable tape adhesion, and full compatibility with mainstream dicing saws, wafer grinders, and tape mounting machines used in IC, LED, and MEMS manufacturing.

Specifications

ParameterValue
MaterialSUS304/SUS420 Stainless Steel
Compatible Wafer Size6in/8in/12in
Outer Frame ShapeOctagonal
Inner Opening ShapeCircular
Surface TreatmentMirror Polishing
ColorSilver (Metallic)
Compatible TapeUV Dicing Tape/BG Tape
Compatible EquipmentDicing Saw/Wafer Grinder/Tape Mounter
Applicable ProcessDicing/Back-grinding/Mounting
UsageReusable

Applications

1. Semiconductor wafer dicing and singulation process 2. Wafer back-grinding and thinning process 3. Wafer mounting with UV dicing tape or BG tape 4. LED chip and optoelectronic device dicing 5. IC packaging, MEMS device and discrete device manufacturing 6. Wafer handling, storage and transportation

Key Features

1. Made of high-quality stainless steel with excellent rigidity, durability and corrosion resistance 2. Precision-machined circular inner opening ensures secure wafer mounting and reliable tape adhesion 3. Octagonal outer profile fully compatible with industry-standard dicing saws, grinders and tape mounters 4. Mirror-polished surface prevents particle contamination and wafer damage 5. Reusable design helps reduce production cost in mass manufacturing 6. Available for mainstream wafer sizes such as 6-inch, 8-inch and 12-inch

Datasheet

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Supplier Information

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Zzqsjm
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<p>Since its establishment in 2014, Qisheng Precision has been focusing on the semiconductor and precision manufacturing industry, specializing in R&D and manufacturing of dicing equipment, superhard tools, and precision grinding products. It is one of the few high-tech enterprises in China that truly achieves dual-track independent R&D of "equipment + tools". Core strengths: integrated R&D and manufacturing, three business divisions, full-chain capability; professional R&D team mastering core technologies. Core products: precision dicing machines, full series of dicing blades (electroformed, resin, metal), precision grinding products (thinning wheels, ceramic chucks, etc.). Applications: integrated circuits, LED chips, optical components, new energy batteries, electronic ceramics, magnetic materials. Served thousands of enterprises across 30 provinces. Vision: Perseverance, proactiveness, harmonious work, self-transcendence; striving for innovation and precision.</p>

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Stainless Steel Wafer Dicing Frame (Wafer Ring / Film Frame)
Zzqsjm · Semiconductor Packaging Equipment
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