The 2x2 Fiber Array is a precision passive optical component that integrates four optical fibers in a two-dimensional square layout based on high-precision V-groove technology. As shown in the product image, the array is mounted on a dicing frame with blue mounting film, and the four fiber end faces are arranged in a compact 2x2 pattern at the center, ensuring accurate core-to-core alignment. The component is designed for high-density optical coupling and packaging, providing low insertion loss, high return loss and excellent environmental reliability. It is widely used for coupling with PLC splitter chips, AWG chips and multi-channel optical transceiver modules in optical communication systems. Core pitch, fiber type, polishing angle and overall dimensions can be customized according to customer requirements.
| Parameter | Value |
| Number of Channels | 4 (2x2) |
| Fiber Type | SMF-28e (G.652.D) |
| Core Pitch | 127μm/250μm |
| Core Position Accuracy | ≤±0.5μm |
| Insertion Loss | ≤0.3dB |
| Return Loss | ≥55dB |
| Operating Wavelength | 1260~1650nm |
| V-Groove Material | Silicon/Pyrex Glass |
| Lid Material | Pyrex Glass/Quartz |
| Operating Temperature | -40~+85°C |
| Storage Temperature | -40~+85°C |
| Dimensions | Customizable |
1. Coupling and packaging of PLC optical splitter chips 2. Coupling and packaging of AWG (Arrayed Waveguide Grating) chips 3. Multi-channel optical transceiver modules (parallel optics) 4. Optical interconnection in data centers 5. Silicon photonics and optoelectronic hybrid integration 6. Optical sensing and testing equipment
1. High-precision 2x2 two-dimensional fiber arrangement with core position accuracy up to ±0.5μm 2. Low insertion loss and high return loss for reliable optical coupling 3. Compact structure suitable for high-density optoelectronic packaging 4. Optional 0° PC or 8° APC polishing end faces 5. Silicon or Pyrex glass V-groove substrate with excellent thermal stability 6. Wide operating temperature range of -40~+85°C 7. Customizable core pitch, fiber type and dimensions
<p>Since its establishment in 2014, Qisheng Precision has been focusing on the semiconductor and precision manufacturing industry, specializing in R&D and manufacturing of dicing equipment, superhard tools, and precision grinding products. It is one of the few high-tech enterprises in China that truly achieves dual-track independent R&D of "equipment + tools". Core strengths: integrated R&D and manufacturing, three business divisions, full-chain capability; professional R&D team mastering core technologies. Core products: precision dicing machines, full series of dicing blades (electroformed, resin, metal), precision grinding products (thinning wheels, ceramic chucks, etc.). Applications: integrated circuits, LED chips, optical components, new energy batteries, electronic ceramics, magnetic materials. Served thousands of enterprises across 30 provinces. Vision: Perseverance, proactiveness, harmonious work, self-transcendence; striving for innovation and precision.</p>