Single-Channel Fiber Optic Rotary Joint (FORJ)

Channel Number: 1 Operating Wavelength: 850nm/1310nm(MM),1310nm/1550nm(SM) Insertion Loss: ≤3.0dB

This product is a precision-engineered single channel Fiber Optic Rotary Joint (FORJ), also known as an optical slip ring. It features a compact stainless steel cylindrical body with a front mounting flange equipped with four fixing holes, a central rotating hub with a precision bore, and sealed internal optical paths. It is designed to transmit optical signals without interruption between a stationary platform and a continuously rotating platform, eliminating fiber twisting and signal loss during 360° rotation. The sealed stainless steel housing with O-ring protection ensures reliable performance in harsh industrial, marine, and outdoor environments.

Number of Channels: 4 (2x2) Fiber Type: SMF-28e (G.652.D) Core Pitch: 127μm/250μm

The 2x2 Fiber Array is a precision passive optical component that integrates four optical fibers in a two-dimensional square layout based on high-precision V-groove technology. As shown in the product image, the array is mounted on a dicing frame with blue mounting film, and the four fiber end faces are arranged in a compact 2x2 pattern at the center, ensuring accurate core-to-core alignment. The component is designed for high-density optical coupling and packaging, providing low insertion loss, high return loss and excellent environmental reliability. It is widely used for coupling with PLC splitter chips, AWG chips and multi-channel optical transceiver modules in optical communication systems. Core pitch, fiber type, polishing angle and overall dimensions can be customized according to customer requirements.

Detector Type: Blue-Enhanced Si PIN Photodiode Chip Chip Material: Si Spectral Response Range: 350-1100nm

A large-area blue-enhanced silicon PIN photodiode die supplied in chip-on-submount form. The circular photosensitive surface uses an anti-reflection/passivation coating that boosts sensitivity in the blue and near-UV bands while maintaining broadband response to the near infrared. A small centered top bond pad defines the front electrode, and the surrounding metallized carrier with orientation flats supports accurate pick-and-place, die attach and wire bonding in OEM detector assemblies.

Material: SUS304/SUS420 Stainless Steel Compatible Wafer Size: 6in/8in/12in Outer Frame Shape: Octagonal

This product is a stainless steel wafer dicing frame, also known as a wafer ring or film frame, designed for semiconductor and optoelectronic wafer-level processing. The frame features a precision-machined circular inner opening and an octagonal outer profile, and is used together with UV dicing tape or back-grinding tape to hold wafers securely during dicing, grinding, mounting, and transportation. Its polished metallic surface and rigid structure ensure stable wafer support, reliable tape adhesion, and full compatibility with mainstream dicing saws, wafer grinders, and tape mounting machines used in IC, LED, and MEMS manufacturing.