COC Tester
The LASER X COC Tester is an automated test platform for chip-on-carrier laser devices. It integrates magazine-style automatic loading and unloading, a dual-platform layout, 48/32-position COC fishbone fixtures, LIV/PIV testing, optical spectrum testing, back-facet power testing and TEC temperature control from 20~100℃. With support for simultaneous testing on both sides of the fixture and compatibility with burn-in machines and gold-wire bonding machines, it is designed for fast, repeatable electro-optical characterization in large-scale production.
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Overview
The LASER X COC Tester is an automated test platform for chip-on-carrier laser devices. It integrates magazine-style automatic loading and unloading, a dual-platform layout, 48/32-position COC fishbone fixtures, LIV/PIV testing, optical spectrum testing, back-facet power testing and TEC temperature control from 20~100℃. With support for simultaneous testing on both sides of the fixture and compatibility with burn-in machines and gold-wire bonding machines, it is designed for fast, repeatable electro-optical characterization in large-scale production.
Specifications
| Parameter | Value |
|---|---|
| PIV Output Current Range | 0~3000mA |
| PIV Output Current Accuracy | 0.1%+100uA |
| PIV Scan Step | 10uA |
| PIV Scan Time | <4ms/point |
| Spectrum Optical-Path Coupling Time (Single-mode Fiber) | <8s |
| Spectrum Optical-Path Coupling Time (Multi-mode Fiber) | <1s |
| Spectrum Optical-Path Coupling Power (Lens + Multi-mode Fiber) | >-20dBm |
| Spectrum Wavelength Repeatability | ±0.1nm |
| Spectrum Test Time | <2s |
| Temperature Control Method | TEC |
| Temperature Control Range | 20~100℃ |
| Temperature Uniformity | ±1℃ |
| Temperature Stability | ±0.5℃ |
Applications
1. Production-line LIV/PIV and optical spectrum testing of COC laser devices 2. High-volume screening using magazine automatic loading/unloading and dual-platform operation 3. Temperature-dependent electro-optical characterization under TEC control from 20~100℃ 4. Back-facet power monitoring and fiber-coupled optical testing with single-mode or multi-mode fiber 5. Test processes connected with burn-in equipment and gold-wire bonding machines
Key Features
1. Magazine-style automatic loading and unloading 2. Dual-platform design to reduce loading/unloading and temperature-control waiting time 3. Supports LIV and optical spectrum testing 4. 48/32-position COC fixtures compatible with burn-in machines and gold-wire bonding machines 5. TEC temperature control from 20~100℃ for temperature accuracy and stability 6. Supports back-facet optical power test function 7. COC fishbone fixture supports simultaneous testing on both sides 8. Suitable for large-scale mass production
Datasheet
Product Datasheet
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Supplier Information
<p>Leishen Technology (Shenzhen) Co., Ltd. was established in October 2017. It is headquartered in Yufengda Industrial Park, Guangming District, Shenzhen. It has an existing factory area of about 38,000 square meters and an annual production capacity of 2,000+ units. It is a company dedicated to optical communications, semiconductors, and lasers. Optoelectronic chip manufacturing and packaging companies in the fields of processing, lidar and other fields provide precision automated test aging, optical path assembly equipment and systematic solutions. It is now a national specialized and new "little giant" enterprise, a national high-tech enterprise, and a Shenzhen gazelle enterprise.</p>
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