Instrument Complete-Set Control and Remote Operation
Our company focuses on providing efficient and reliable equipment and station warehouse operation and maintenance services for industrial production, energy storage, logistics and warehousing and other fields, covering equipment full life cycle management, intelligent monitoring, preventive maintenance and comprehensive station and warehouse operation support. Through digital tools and professional teams, we help customers improve equipment operation efficiency, reduce operation and maintenance costs, and ensure the safety of production, storage and transportation
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Related Products
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Back-Grinding Plate
Material-based Production Equipment
Zzqsjm
Material Optional: Ceramic
Mainly used for thinning, grinding and CMP polishing processes of semiconductor wafers such as silicon wafers, sapphire wafers, silicon carbide wafers, gallium arsenide wafers, germanium wafers, and gallium nitride wafers
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Dicing Plate
Material-based Production Equipment
Zzqsjm
Material Optional: Ceramic Type: Ceramic
Microporous ceramic and metal work plates are special tools used to adsorb and carry various semiconductor chips during the production process. They are used for scribing, cleaning, and laminating. The work plates produced by our company can be used with equipment made in Japan, Germany and China, and have excellent cost performance advantages
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Cleaning Plate
Material-based Production Equipment
Zzqsjm
Material Optional: Ceramic Type: Ceramic
Microporous ceramic and metal work plates are special tools used to adsorb and carry various semiconductor chips during the production process. They are used for scribing, cleaning, and laminating. The work plates produced by our company can be used with equipment made in Japan, Germany and China, and have excellent cost performance advantages
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Grinding Plate
Material-based Production Equipment
Zzqsjm
Material Optional: Ceramic
Mainly used for thinning, grinding and CMP polishing processes of semiconductor wafers such as silicon wafers, sapphire wafers, silicon carbide wafers, gallium arsenide wafers, germanium wafers, and gallium nitride wafers
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