Back-Grinding Plate
Mainly used for thinning, grinding and CMP polishing processes of semiconductor wafers such as silicon wafers, sapphire wafers, silicon carbide wafers, gallium arsenide wafers, germanium wafers, and gallium nitride wafers
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Material Optional | Ceramic |
Applications
Key Features
Datasheet
Please provide your email to download the datasheet.
Invalid email format. Please try again.
Supplier Information
Related Products
-
Instrument Complete-Set Control and Remote Operation
Material-based Production Equipment
HbSais
Our company focuses on providing efficient and reliable equipment and station warehouse operation and maintenance services for industrial production, energy storage, logistics and warehousing and other fields, covering equipment full life cycle management, intelligent monitoring, preventive maintenance and comprehensive station and warehouse operation support. Through digital tools and professional teams, we help customers improve equipment operation efficiency, reduce operation and maintenance costs, and ensure the safety of production, storage and transportation
-
Dicing Plate
Material-based Production Equipment
Zzqsjm
Material Optional: Ceramic Type: Ceramic
Microporous ceramic and metal work plates are special tools used to adsorb and carry various semiconductor chips during the production process. They are used for scribing, cleaning, and laminating. The work plates produced by our company can be used with equipment made in Japan, Germany and China, and have excellent cost performance advantages
-
Cleaning Plate
Material-based Production Equipment
Zzqsjm
Material Optional: Ceramic Type: Ceramic
Microporous ceramic and metal work plates are special tools used to adsorb and carry various semiconductor chips during the production process. They are used for scribing, cleaning, and laminating. The work plates produced by our company can be used with equipment made in Japan, Germany and China, and have excellent cost performance advantages
-
Grinding Plate
Material-based Production Equipment
Zzqsjm
Material Optional: Ceramic
Mainly used for thinning, grinding and CMP polishing processes of semiconductor wafers such as silicon wafers, sapphire wafers, silicon carbide wafers, gallium arsenide wafers, germanium wafers, and gallium nitride wafers
Related Articles
A laser bar is an array semiconductor laser chip integrated with dozens of emitters, which realizes hundred-watt quasi-continuous output on a single chip. With regular emitter arrangement and controllable fill factor, integrated thermal design and superior wall-plug efficiency compared to single chips, it acts as the core light source for high-power pumping, medical lasers and precision processing.
Driven by the continuous pursuit of higher precision and efficiency in optical communication and optoelectronic device manufacturing, OLCR-1000 Low-Coherence Interferometer, independently developed by Wuhan Guanggu Interconnect Technology Co., Ltd., provides an innovative technical solution for distributed return loss testing of optical fibers and optoelectronic devices.
Fluoride crystal glass and K9 optical glass are two core optical substrates widely used in precision optical systems, laser equipment and photoelectric scientific research.
For pulsed laser and full-spectrum optical testing, photodiodes and thermopiles have inherent drawbacks. Photodiodes show weak response in infrared band, while thermopiles feature slow response and cannot capture nanosecond narrow pulses.
Loading...
Name
Phone
Organization
Use Case
Database Platform