TS2000-HP
The TS2000-HP is a 200 mm automated probe system designed for high power measurements up to 10 kV and 600 A. It features advanced anti-arcing technologies, ShieldEnvironment™ for EMI/RFI shielding, and ergonomic design for safe and efficient operation.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Chuck XY Stage Travel Range | 210x300mm |
| Chuck XY Stage Resolution | 0.5μm |
| Chuck XY Stage Accuracy | ±2.0μm |
| Chuck XY Stage Repeatability | ±2.0μm |
| Chuck XY Stage Drive | High resolution stepper motor with linear encoder feedback system |
| Chuck XY Stage Speed | 10μm/sec to 50μm/sec |
| Chuck Z Stage Travel Range | 50mm |
| Chuck Z Stage Resolution | 0.2μm |
| Chuck Z Stage Accuracy | ±2.0μm |
| Chuck Z Stage Repeatability | ±1.0μm |
| Chuck Z Stage Drive | High resolution stepper motor with integrated pin drive system |
| Chuck Z Stage Speed | 10μm/sec to 4μm/sec |
| Chuck Theta Stage Travel Range | ±6.0° |
| Chuck Theta Stage Resolution | 0.0004° |
| Chuck Theta Stage Accuracy | <2.0μm |
| Chuck Theta Stage Repeatability | <1.0μm |
| Chuck Theta Stage Drive | High resolution stepper motor with linear encoder feedback system |
| Video Camera Sensor Type | 1/1.8'' mono CCD |
| Video Camera Sensor Size | 7.07mm x 5.3mm |
| Video Camera Pixels | 3MP |
| Video Camera Resolution | 2048x1536 pixels |
| Wafer Alignment Camera Sensor Type | 1/1.8'' color CCD |
| Wafer Alignment Camera Sensor Size | 7.07mm x 5.3mm |
| Wafer Alignment Camera Pixels | 3MP |
| Wafer Alignment Camera Resolution | 2048x1536 pixels |
| Microscope XYZ Travel Range | 50x50mm |
| Microscope XYZ Resolution | 1μm |
| Microscope XYZ Repeatability | <2μm |
| Microscope XYZ Accuracy | <5μm |
| Microscope Z Travel Range | 140mm |
| Microscope Z Resolution | 0.05μm |
| Microscope Z Repeatability | <2μm |
| Microscope Z Accuracy | <4μm |
| Probe Platen Material | Nickel plated steel |
| Probe Platen Height | min. 5mm |
| Probe Platen Feature | Integrated Air-Cool platen control for thermal stability |
| Probe Platen Max. MicroPositioners | 8x DC or 4x DC + 2x RF or 2x DC + 4x RF |
| ShieldEnvironment EMI Shielding | ≥30dB @ 1kHz to 1MHz |
| ShieldEnvironment Light Attenuation | ≥130dB |
| ShieldEnvironment Spectral Noise Floor | ≤-180dBVrms/rtHz @ ≤1MHz |
| ShieldEnvironment System AC Noise | ≤5mVp-p @ ≤1GHz |
| High Current Probe Max Current | 40A to 250A |
| High Current Probe Max Voltage | 500V to 10kV |
| High Current Probe Residual Resistance | ≤5mΩ to ≤1mΩ |
| High Current Probe Leakage | ≤1pA |
| High Current Probe Connector Options | Banana plug or BNC |
| High Current Probe Replaceable Tip | Yes |
| High Current Probe Pitch | 350μm to 650μm |
| High Voltage Probe Max Current | 2A |
| High Voltage Probe Max Voltage | 3kV to 10kV |
| High Voltage Probe Leakage | ≤600pA to ≤35TΩ |
| High Voltage Probe Connector Options | HV triaxial or banana plug |
| High Voltage Probe Replaceable Tip | Yes |
| High Voltage Probe Pitch | Single needle |
| Ultra High Power Probe Max Current | 20A to 250A |
| Ultra High Power Probe Max Voltage | 10kV |
| Ultra High Power Probe Residual Resistance | ≤5mΩ to ≤1mΩ |
| Ultra High Power Probe Connector Options | Banana |
| Ultra High Power Probe Replaceable Tip | Yes |
| Ultra High Power Probe Tip Width | 250μm |
| Ultra High Power Probe Pitch | 650μm |
| Non-Thermal Chuck Diameter | 210mm |
| Non-Thermal Chuck Material | Gold plated aluminum |
| Non-Thermal Chuck Surface Planarity | ≤5μm |
| Non-Thermal Chuck Rigidity | <15μm/10N @edge |
| Non-Thermal Chuck Electrical Specification Chuck Isolation | ≥30TΩ |
| Non-Thermal Chuck Electrical Specification Force to Guard | ≥30TΩ |
| Non-Thermal Chuck Electrical Specification Guard to Shield | ≥500GΩ |
| Non-Thermal Chuck Electrical Specification Force to Shield | ≥100GΩ |
| High Power Thermal Chuck Temperature Range | -60°C to 300°C |
| High Power Thermal Chuck Temperature Stability | ±0.08°C |
| High Power Thermal Chuck Temperature Accuracy | 0.1°C |
| High Power Thermal Chuck Temperature Uniformity | <±0.5°C |
| High Power Thermal Chuck Surface Flatness | <±10μm |
| High Power Thermal Chuck Heating Rates | 25°C to 300°C <40min |
| High Power Thermal Chuck Cooling Rates | 300°C to 25°C <40min |
| High Power Thermal Chuck Max Voltage | 10kV DC |
| System Controller CPU | Intel Core i7-7700, 3.6GHz, 8M Cache |
| System Controller RAM | DDR4 2400MHz 16GB |
| System Controller Operating System | Windows 10 Professional |
| System Controller Power | 460W |
| System Controller Storage | SSD 500GB |
| System Controller LAN | One internal and one external TCP/IP ports |
| System Controller USB Ports | Internal (on PC) x3, external x1 |
| System Controller GPIB Interface | Optional |
| System Dimensions | 1420x1140x1740mm |
| System Weight | 700kg |
Applications
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Datasheet
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