Mini EDFA Series
Mini EDFA series, its main features are small size and low power. Using small components and small bend radius fibers, from half MSA to 35*12*5.5mm, or thin tray products, it realizes single-wave amplification with output power of about 10dBm, mainly used in metro networks and DCO coherent modules.
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| size | 35x18x5.5 mm, Smaller |
| Input Power | -15~-10dBm |
| Output Power | >4dBm |
| Power Consumption | <2w |
Applications
Key Features
Datasheet
Please provide your email to download the datasheet.
Invalid email format. Please try again.
Supplier Information
Related Products
-
Normal EDFA Series
Semiconductor Packaging Equipment
Taclink
Gain ripple [EDFA-BA,PA,LA；typ. condition]: <1.0dB typ. condition NF [EDFA-BA,PA,LA；for typ. C Condition]: <6.0dB for typ. C Condition NF [EDFA-BA,PA,LA；for typ. L Condition]: <6.5dB for typ. L Condition
Normal-type EDFA, including single-wave, multi-wave, pure optical, and powered EDFA, with dimensions above 90*70*15mm, can achieve higher gain and larger power output. There are fixed-gain EDFA as well as adjustable gain and gain-slope EDFA. Gain can be 10~38dB, power can reach 20dBm, even above 27dBm. Typical noise is around 5.5dB. Such amplifiers are widely used in backbone networks and metro networks, widely applied in OTN and PTN, and are one of the important functional components of optical communication systems.
-
Single-axis precision dicing machine (semi-automatic)
Semiconductor Packaging Equipment
Qhlaser
Stage format: 310 mm × 310 mm X-axis working stroke: 0-600 mm Y1, Y2 axis working stroke: 0-500mm
● Wafer cutting equipment using high-precision bidirectional silent air spindle:; ● Cutting area: 4 inch, 6 inch wafers;; ● High precision: for resin substrates with irregular expansion and contraction, high-precision processing is possible through cutting line calibration at multiple points;; ● Simple and convenient operation: 17-inch touch screen;; ● Automatic blade mark calibration function: automatically measures the offset of the cutting street and the width of the cutting mark, managing processing quality;; ● Blade breakage detection function: blade breakage detection during cutting.; ● 4/6 inch IC, wafer cutting; ● Silicon, quartz, aluminum oxide, iron oxide, gallium arsenide, sapphire, glass, etc.
-
Dual-spindle precision dicing saw (fully automatic)
Semiconductor Packaging Equipment
Qhlaser
Stage format: ∅300mm X-axis working stroke: 0-770mm Y1, Y2 axis working stroke: 0-470mm
Large-scale package substrate cutting equipment using opposed, high-precision bidirectional silent air spindles:; ● High production efficiency: basket loading, automatic loading/unloading + automatic cutting + automatic cleaning functions;; ● High precision: for resin substrates with irregular stretchable materials, high-precision processing is possible through multi-point cutting line calibration;; ● Simple and convenient operation: 19-inch touch screen;; ● Automatic calibration function: calibration can be performed by selecting recorded workpiece data;; ● Automatic blade mark calibration function: automatically measures the offset of the cutting street and the width of the cutting mark, managing processing quality;; ● More complete functions: supports diverse full-cut/half-cut processes, a more advanced ∅300mm format cutting machine.; ● Large-scale package substrates; ● IC, LED, QFN, etc.; ● Silicon, quartz, alumina, iron oxide, gallium arsenide, sapphire and glass, etc.
-
Dual-spindle precision dicing saw (semi-automatic)
Semiconductor Packaging Equipment
Qhlaser
Stage format: 310 mm × 310 mm X-axis working stroke: 0-600 mm Y1, Y2 axis working stroke: 0-500mm
Large-scale package substrate cutting equipment using opposed, high-precision bidirectional silent air spindles:; ● High efficiency: dual spindles cutting simultaneously can increase production efficiency by up to 90% compared with a single-spindle cutting machine;; ● High precision: for resin substrates with irregular stretchable materials, high-precision processing is possible through multi-point cutting line calibration;; ● Simple and convenient operation: 19-inch touch screen;; ● The equipment adopts a marble base and, combined with a high-precision linear motor and vision positioning system, enables large-format, high-efficiency, high-precision and stable processing;; ● Automatic blade mark calibration function: automatically measures the offset of the cutting street and the width of the cutting mark, managing processing quality;; ● Large-scale package substrates; ● IC, LED, QFN, etc.; ● Silicon, quartz, alumina, iron oxide, gallium arsenide, sapphire and glass, etc.
Related Articles
As fundamental refractive optical components, plano‑convex spherical lenses consist of one convex spherical surface and one flat surface.
Wuhan Optical Valley Interlink Technology Co., Ltd. was founded in 2013 by a technical team from Huazhong University of Science and Technology.
FiDAR, the fiber‑optic radar vehicle positioning and tracking system developed by Jianhe Bafang, is a high‑sensitivity distributed fiber‑sensing solution designed for intelligent traffic road monitoring. It outputs real‑time spatial coordinates of every vehicle across the full road section around‑the‑clock, delivering a brand‑new sensing technology for vehicle‑road cooperation, smart highway construction and urban traffic management.
GYOPTICS 30 W collimated isolator is a highly‑reliable passive optical component optimized for 1064 nm high‑power laser systems. Characterized by low insertion loss and superior backward‑light suppression capability, it effectively blocks reflected light traveling back toward the laser resonator, eliminating back‑reflection‑induced instability and protecting fiber or solid‑state laser sources during long‑term operation.
Loading...
Name
Phone
Organization
Use Case
Database Platform