Four ceramic lasers, one perforating.
The Saifir lasers developed a series of specialized equipment for the ceramic circuit base plate industry, mainly for the plaque, cutting and poaching of aluminium oxide and nitrogenized aluminium ceramic foundation plate.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Process Lines Wide | ≤0.06 mm |
| Line Depth [Base thickness] | 40-70% (base plate thickness) |
| Cut Depth | ≤3 mm |
| Paddle speed [Aluminium oxide] | 60-150 mm/s (aluminium oxide) |
| Paddle speed [Aluminium nitrogenized] | 40-120 mm/s (aluminium nitrogenization) |
| Cut speed [Aluminium oxide] | 1-100 mm/s (Aluminium oxide) |
| Cut speed [Aluminium nitrogenized] | 1-80 mm/s (aluminium nitrogenization) |
| Minimum hole diameter | 0.06 mm |
Key Features
Datasheet
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