Sapphire Polishing Slurry DPAL-Sapp
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Specifications
| Parameter | Value |
|---|---|
| Particle Size Specifications D50 | D50=30-40μm |
| Abrasive Type | Polycrystalline-Like Diamond |
| Properties | Easy to shake; alcohol-based carrier |
Applications
This product is mainly used to thin ultrahard materials such as sapphire substrates.
Key Features
(1) Used with resin-copper polishing discs, the product provides high removal rates for sapphire wafers while maintaining wafer surface quality. (2) Good cleanability and improved environmental friendliness. (3) Strict quality control ensures consistent, stable product quality. (4) Diamond particle size can be adjusted to customer requirements.
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Supplier Information
Henan Union Precision Material Co., Ltd. was established on June 26, 2002. It is a high-tech enterprise dedicated to the research, development, production and sales of precision grinding and polishing materials and their high-end products. The company currently has a series of products including fine abrasives and fluid abrasives, and is also committed to providing overall grinding and polishing solutions for industries such as semiconductors and integrated circuits. It mainly serves precision processing fields such as semiconductor wafer processing, diamond wire for photovoltaic silicon wafer cutting, consumer electronics grinding and polishing, and sapphire LED substrate grinding, and continuously innovates and achieves breakthroughs in these fields.
Henan Union Precision Material Co., Ltd. attaches importance to standardized management, has passed ISO9001, ISO14001 and ISO45001 system certifications, and strictly implements system specifications. Union Precision has developed into a supplier and service provider of ultra-precision grinding and polishing materials with core competitiveness in the superhard material industry, and has won customers' trust and recognition based on a solid R&D foundation, stable quality and high-quality service.
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