Metal-Hinge Welding Equipment LWF12

Metal-Hinge Welding Equipment LWF12

Supplier
Delphilaser
Part Number
LWF12
Category
Laser Processing Equipment
Origin
China

This equipment is mainly used for welding metal hinges. A customized QCW quasi-continuous-wave fiber laser, coaxial imaging assembly and precision motion platform enable precision spot and seam welding of thin metal sheets.

Specification Snapshot
Positioning accuracy
±3μm
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Overview

This equipment is mainly used for welding metal hinges. A customized QCW quasi-continuous-wave fiber laser, coaxial imaging assembly and precision motion platform enable precision spot and seam welding of thin metal sheets.

Specifications

ParameterValue
LaserCustom
Equipment WorkstationsSingle Head, Single Station
Scanning Range180mm×180mm(customizable)
Working area200 mm × 200 mm
Positioning accuracy±3μm
Repeatability±2μm

Applications

Metal materials such as hinges.

Key Features

Custom high-stability lasers; fast, precise cutting with custom multiplatform options; customized automated lines with robots, AGV, and AOI; mature software accurately calculates/divides patterns and matches process parameters to graphics.

Datasheet

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Supplier Information

De
Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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Metal-Hinge Welding Equipment LWF12
Delphilaser · Laser Processing Equipment
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