ATM90 Fully Automatic Laser Marking Machine (MiniQFN)

ATM90 Fully Automatic Laser Marking Machine (MiniQFN)

Supplier
Delphilaser
Part Number
ATM90
Category
Laser Processing Equipment
Origin
China

Fully automatic laser marking of packaged semiconductor Mini QFN products.

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Overview

Fully automatic laser marking of packaged semiconductor Mini QFN products.

Specifications

ParameterValue
Workpiece DimensionsMax 280 x 100mm;Min 150 x 60mm
Print Content2D, Logo, PIN, Text
Printing Specifications-Depth Control±6um
Printing Specifications-2D Read Rate100%
Printing Specifications - Beam Spot40-80um
Laser Marking AreaHeight measurement; external power-meter check; efficient dust collection; dual-cavity laser
Accuracy Parameters-Overall Positioning Accuracy±35um
Accuracy Parameters - Scanning Accuracy±20um
Accuracy Parameters-Platform Accuracy±5um
Software CapabilitiesSECS/GEM function; automatic Download of Marking information; compatible with mainstream equipment fonts & LOGO.
Operating Motion MethodHigh-Precision Marble Stage Module
Loading and UnloadingFully Automatic Slot Mag Loading/Unloading
Visual Orientation Inspection/2D Code Reading-2D ReadingMark Out function (Keyence SR-1000)
Visual Orientation Inspection/2D Code Reading-Reverse-Orientation PreventionVisual Inspection
Vision System-Marking vision PositioningUpper/Lower Vision Cameras for Point-Based Positioning
Vision System-QC SystemHigh-Resolution Camera with Four-Side Adjustable Bar Light Source

Applications

Marking Mini QFN products after semiconductor packaging

Datasheet

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Supplier Information

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Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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ATM90 Fully Automatic Laser Marking Machine (MiniQFN)
Delphilaser · Laser Processing Equipment
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