ATM90 Fully Automatic Laser Marking Machine (MiniQFN)
Fully automatic laser marking of packaged semiconductor Mini QFN products.
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Overview
Fully automatic laser marking of packaged semiconductor Mini QFN products.
Specifications
| Parameter | Value |
|---|---|
| Workpiece Dimensions | Max 280 x 100mm;Min 150 x 60mm |
| Print Content | 2D, Logo, PIN, Text |
| Printing Specifications-Depth Control | ±6um |
| Printing Specifications-2D Read Rate | 100% |
| Printing Specifications - Beam Spot | 40-80um |
| Laser Marking Area | Height measurement; external power-meter check; efficient dust collection; dual-cavity laser |
| Accuracy Parameters-Overall Positioning Accuracy | ±35um |
| Accuracy Parameters - Scanning Accuracy | ±20um |
| Accuracy Parameters-Platform Accuracy | ±5um |
| Software Capabilities | SECS/GEM function; automatic Download of Marking information; compatible with mainstream equipment fonts & LOGO. |
| Operating Motion Method | High-Precision Marble Stage Module |
| Loading and Unloading | Fully Automatic Slot Mag Loading/Unloading |
| Visual Orientation Inspection/2D Code Reading-2D Reading | Mark Out function (Keyence SR-1000) |
| Visual Orientation Inspection/2D Code Reading-Reverse-Orientation Prevention | Visual Inspection |
| Vision System-Marking vision Positioning | Upper/Lower Vision Cameras for Point-Based Positioning |
| Vision System-QC System | High-Resolution Camera with Four-Side Adjustable Bar Light Source |
Applications
Marking Mini QFN products after semiconductor packaging
Datasheet
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Supplier Information
Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.
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