DPC Ceramic Substrate Rapid Drilling Equipment RPS10

DPC Ceramic Substrate Rapid Drilling Equipment RPS10

Supplier
Delphilaser
Part Number
RPS10
Category
Laser Processing Equipment
Origin
China

Depending on thickness, material and processing-quality requirements, drilling or cutting equipment can be selected for drilling, cutting or punching most DPC ceramics, including alumina (Al2O3), aluminum nitride (AlN) and zirconia (ZrO2).

Specification Snapshot
Equipment Type
Single Head
Positioning accuracy
±3μm
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Overview

Depending on thickness, material and processing-quality requirements, drilling or cutting equipment can be selected for drilling, cutting or punching most DPC ceramics, including alumina (Al2O3), aluminum nitride (AlN) and zirconia (ZrO2).

Specifications

ParameterValue
Equipment TypeSingle Head
Working area250mm×250mm/450mm×450mm(customizable)
Positioning accuracy±3μm
Repeatability±2μm
Scribing speed250mm/s
Drilling Speed>15 Holes/Second
Cutting speed40mm/s

Applications

LED packaging lead frames; passive components; thick- and thin-film circuit substrates; microcrystalline zirconium appearance parts.

Key Features

Wide drilling-diameter adjustment range; drilling efficiency above 15 holes per second; image-based target acquisition with optional automated loading/unloading; hole roundness >85%; hole taper <15μm.

Datasheet

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Supplier Information

De
Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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DPC Ceramic Substrate Rapid Drilling Equipment RPS10
Delphilaser · Laser Processing Equipment
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