Production-Line Integrated Laser Processing Equipment

Production-Line Integrated Laser Processing Equipment

Supplier
Delphilaser
Category
Laser Processing Equipment
Origin
China

This equipment mainly performs P0 marking, P1/P2/P3 scribing and P4 edge deletion on perovskite solar-cell process substrates. Fully automatic unattended operation supports 100MW/150MW/1GW production lines.

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Overview

This equipment mainly performs P0 marking, P1/P2/P3 scribing and P4 edge deletion on perovskite solar-cell process substrates. Fully automatic unattended operation supports 100MW/150MW/1GW production lines.

Applications

P0 marking, P1/P2/P3 scribing, and P4 edge deletion of in-process perovskite solar cells.

Key Features

Unattended automatic production for 100MW/150MW/1GW lines; up to 24 split beams; area 1200×2400mm; proprietary precise fast stage, scribing ≥2500mm/s, dead zone ≤150μm; inline insulation/barrier lines; path tracking, focus following, PSO, automatic power detection/calibration; integrated dust removal above 99.9%; vibration-resistant research-grade marble platform; proprietary production-line software and extensive multilayer scribing parameter library.

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Supplier Information

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Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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Production-Line Integrated Laser Processing Equipment
Delphilaser · Laser Processing Equipment
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